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Green circuit board with black memory chips, no heat spreader, 260-pin DDR4 SODIMM form factor

NEMIX RAM

NEMIX RAM 32GB DDR4 3200 CL22 2Rx8 1.2V 260-PIN ECC SODIMM memory upgrade

SKU CH-X142-1SHXG

32 GB DDR4 3200 ECC SODIMM module for Micron servers and workstations, CL22 unbuffered at 1.2 V

  • Capacity32GB
  • SpeedDDR4 3200 (PC4 25600)
  • ECCYes
  • Buffered/RegisteredUnbuffered
  • ChipsetMajor OEM Samsung, Micron, Hynix
  • Voltage1.20V
  • 32 GB capacity lets you run large workloads without swapping
  • DDR4 3200 speed moves data quickly through the memory bus
  • ECC protection detects and corrects single-bit errors for stability
  • 2 V operation keeps power draw low in dense systems
  • 260-pin SODIMM form factor fits compatible Micron laptops and workstations

Compatible Micron Server Memory

This 32GB DDR4 3200 module is built for Micron-based servers and workstations that require ECC unbuffered SODIMMs. It targets administrators who need single-slot capacity upgrades without registered buffering.

260-Pin ECC SODIMM Build

The module uses a standard 260-pin SODIMM edge connector and operates at 1.20V with no heat spreader. Its unbuffered design means it plugs directly into compatible Micron platforms for straightforward installation.

CL22 Latency at 3200 MT/s

CAS latency is rated at CL22 (22 cycles) while running at DDR4 3200 (PC4-25600). This timing determines whether the module meets the platform's memory-controller requirements.

Punti di forza

  • 32 GB capacity lets you run large workloads without swapping
  • DDR4 3200 speed moves data quickly through the memory bus
  • ECC protection detects and corrects single-bit errors for stability
  • 2 V operation keeps power draw low in dense systems
  • 260-pin SODIMM form factor fits compatible Micron laptops and workstations

Caratteristiche tecniche

BrandNEMIX RAM
SeriesMicron Server/Workstaion Compatible Series Memory
ModelMicron DDR4 3200MHZ ECC Unbuffered SODIMM
Part NumberMSE25600-328K1
Capacity32GB
SpeedDDR4 3200 (PC4 25600)
ECCYes
Buffered/RegisteredUnbuffered
ChipsetMajor OEM Samsung, Micron, Hynix
Voltage1.20V
Compatible SystemMICRON
CAS LatencyCL22
Heat SpreaderNo
Type260-PIN DDR4 ECC SODIMM
Rank2Rx8
FeaturesDDR4 ECC Unbuffered SODIMM Motherboard Compatible
Package Content32GB (1X32GB) DDR4 3200MHZ PC4-25600 2Rx8 1.2V CL22 260-PIN ECC Unbuffered SODIMM

Domande su questo articolo

What does the DDR4 3200 PC4-25600 interface cap at in real use?

The DDR4 3200 PC4-25600 interface runs at up to 3200 MT/s with CL22 latency and 1.20 V, providing 25600 MB/s peak bandwidth.

What physical slot and form factor does this 260-pin SODIMM require?

It requires a 260-pin DDR4 SODIMM slot and fits the standard low-profile SODIMM height since it has no heat spreader.

How is the module installed and which step is often missed?

Insert the module at an angle until the contacts are fully seated, then press down evenly until the side retention clips click into the notches on both ends.

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