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Two green DDR4 UDIMM sticks without heat spreaders

NEMIX RAM

NEMIX RAM MD25600-818K2 16GB (2x8GB) DDR4 3200 CL22 1.2V 288-pin UDIMM for MSI B550-A PRO memory upgrade

SKU CH-S6DQ-DXEXN

A 16 GB DDR4 3200 CL22 1.2 V dual-channel kit validated for the MSI B550-A PRO motherboard

  • Capacity16GB (2 x 8GB)
  • SpeedDDR4 3200 (PC4 25600)
  • ECCNo
  • Buffered/RegisteredUnbuffered
  • ChipsetMajor OEM Samsung, Micron, Hynix
  • Voltage1.20V
  • 16 GB dual-channel kit boosts multitasking headroom
  • DDR4 3200 MT/s CL22 delivers responsive desktop performance
  • 20 V low-voltage operation reduces power draw
  • 288-pin UDIMM form factor fits standard desktop slots
  • Tested for MSI B550-A PRO motherboard compatibility

MSI B550-A PRO compatible DDR4 kit

This 16GB kit contains two 8GB DDR4 3200 modules built for the MSI B550-A PRO motherboard. It targets desktop builders who want a straightforward memory upgrade validated for that specific platform. The unbuffered non-ECC design suits standard consumer workloads without server features.

Matched pair tested for dual-channel operation

The two modules are packaged together and stress-tested as a kit to ensure stable dual-channel performance on the target board. No extra software, heat spreaders or RGB lighting are included; the package delivers only the memory sticks themselves. Installation follows standard UDIMM procedure.

16GB capacity at CL22 1.2V

The 16GB total handles everyday multitasking, office suites and mainstream gaming comfortably. CL22 latency at 1.20V provides standard JEDEC headroom without overclocking overhead. Builders needing more than 16GB or lower latency timings should look beyond this kit.

Punti di forza

  • 16 GB dual-channel kit boosts multitasking headroom
  • DDR4 3200 MT/s CL22 delivers responsive desktop performance
  • 20 V low-voltage operation reduces power draw
  • 288-pin UDIMM form factor fits standard desktop slots
  • Tested for MSI B550-A PRO motherboard compatibility

Caratteristiche tecniche

BrandNEMIX RAM
SeriesMSI Gaming Motherboard Compatible Series Memory
ModelMSI DDR4 3200MHZ Non-ECC Unbuffered UDIMM
Part NumberMD25600-818K2
Capacity16GB (2 x 8GB)
SpeedDDR4 3200 (PC4 25600)
ECCNo
Buffered/RegisteredUnbuffered
ChipsetMajor OEM Samsung, Micron, Hynix
Voltage1.20V
Compatible SystemMSI
CAS LatencyCL22
Heat SpreaderNo
Type288-Pin DDR4 UDIMM
Rank1Rx8
FeaturesDDR4 Non- ECC Unbuffered UDIMM Motherboard Compatible
Package Content16GB (2X8GB) DDR4 3200MHZ PC4-25600 1Rx8 1.2V CL22 288-PIN Non-ECC Unbuffered UDIMM KIT

Domande su questo articolo

Will the CL22 latency require any future timing adjustments or module replacement?

The modules run at CL22 from the factory and need no timing changes; they are standard DDR4 UDIMMs with no heat spreader, so no maintenance or replacement is expected.

What limit appears first when the kit runs at 3200 MT/s continuously?

The CAS latency of CL22 at 3200 MT/s is the primary timing constraint under sustained load, not bandwidth or voltage headroom.

How much heat or power does the 1.20 V kit generate during all-day operation?

At 1.20 V the two 8 GB modules draw minimal power and produce little heat, and they have no heat spreader because thermal output is low.

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