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Green rectangular memory module with black chips and silver heat spreader

SAMSUNG

SAMSUNG M386B4G70DM0-CMA 32GB DDR3 1866 ECC Chipkill Load Reduced memory upgrade

SKU CH-44KP-A6ZD7 MPN M386B4G70DM0-CMA

32 GB DDR3 1866 server memory with ECC Chipkill, load-reduced design and CL13 latency

  • Capacity32GB
  • SpeedDDR3 1866 (PC3 14900)
  • CAS LatencyCL13
  • Voltage1.50V
  • ECCECC Chipkill
  • Buffered/RegisteredLoad Reduced
  • 32 GB capacity supports large server workloads
  • DDR3 1866 speed delivers PC3 14900 bandwidth
  • ECC Chipkill corrects multi-bit errors automatically
  • Load Reduced design lowers electrical load on memory bus
  • CL13 latency at 1.50 V balances response and stability

Server-ready DDR3 memory module

This 32 GB Samsung module operates at DDR3 1866 with a CAS latency of CL13 and a voltage of 1.50 V. It is built for server platforms that require registered DIMMs. The load-reduced design reduces electrical load on the memory bus.

ECC Chipkill and heat spreader

On-board ECC Chipkill corrects multi-bit errors to protect data integrity in critical workloads. The integrated heat spreader helps maintain stable temperatures during sustained operation. The module uses a 4Rx4 organisation with major brand chipset components.

DDR3 1866 interface limits

The DDR3 1866 standard caps transfer rates at PC3 14900 bandwidth. Systems limited to lower DDR3 speeds will clock this module down automatically. Platforms that do not support load-reduced or ECC Chipkill registered DIMMs cannot use this memory.

Punti di forza

  • 32 GB capacity supports large server workloads
  • DDR3 1866 speed delivers PC3 14900 bandwidth
  • ECC Chipkill corrects multi-bit errors automatically
  • Load Reduced design lowers electrical load on memory bus
  • CL13 latency at 1.50 V balances response and stability

Caratteristiche tecniche

BrandSAMSUNG
ModelM386B4G70DM0-CMA
Capacity32GB
SpeedDDR3 1866 (PC3 14900)
CAS LatencyCL13
Voltage1.50V
ECCECC Chipkill
Buffered/RegisteredLoad Reduced
Rank4Rx4
ChipsetMajor Brand Chipset
Heat SpreaderYes
FeaturesReliable, high performance
4Rx4
Peso di spedizione0.09 kg
Dimensioni del pacco140 × 51 × 13 mm

Domande su questo articolo

Will the 4Rx4 load-reduced ECC Chipkill module need firmware updates or scheduled replacement during its service life?

No firmware updates are required for this DDR3 1866 module; the 32 GB stick is built with a heat spreader and Major Brand Chipset components for long-term server operation.

What limit appears first when the 1.50 V CL13 memory runs at full 1866 MT/s load continuously?

The thermal ceiling of the 4Rx4 load-reduced design is reached before signal timing margins, so sustained throughput is capped by the module's ability to dissipate heat through its spreader.

How much heat and noise does the 32 GB DDR3 1866 stick produce inside a populated server chassis all day?

The module draws 1.50 V with a heat spreader but has no moving parts, so it adds only passive thermal load and zero acoustic noise to the chassis airflow.

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