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SK hynix

SK hynix 16GB 2x8GB DDR3 PC3L-12800U 1600MHz 1.35V CL11 memory upgrade

SKU CH-S332-SET8P

16 GB kit of two 8 GB DDR3 modules running at 1600 MHz and 1.35 V with CL11 timing

  • Dual-channel 16 GB kit enables smoother multitasking
  • Low 1.35 V operation reduces system power draw
  • CL11 latency at 1600 MHz delivers responsive performance
  • 240-pin DDR3 modules install in standard desktop slots
  • Non-ECC unbuffered design suits consumer motherboards

16 GB DDR3 desktop kit

This kit provides 16 GB of DDR3 memory in a matched pair of 8 GB modules. It is built for desktop systems that accept 240-pin PC3L-12800U DIMMs running at 1.35 V. The non-ECC design suits standard consumer workloads.

Low-voltage thermal profile

Each module operates at 1.35 V, reducing heat output compared to standard 1.5 V DDR3. The CL11 latency and 1600 MHz data rate keep power draw modest during typical desktop use. No special cooling is required beyond normal case airflow.

240-pin PC3L-12800U form factor

Compatibility depends on the motherboard supporting 240-pin DDR3 slots at 1.35 V with PC3L-12800U signalling. Systems limited to 1.5 V-only slots or registered memory will not accept this kit.

Punti di forza

  • Dual-channel 16 GB kit enables smoother multitasking
  • Low 1.35 V operation reduces system power draw
  • CL11 latency at 1600 MHz delivers responsive performance
  • 240-pin DDR3 modules install in standard desktop slots
  • Non-ECC unbuffered design suits consumer motherboards

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Domande su questo articolo

How do I install the 240-pin DDR3 modules and what step is often missed?

Align the notch on each module with the slot key, press straight down until both side clips click, then verify the system recognises the full 16 GB at 1600 MHz.

What maintenance or replacement will this memory need later?

No scheduled maintenance is required; if errors appear, run a memory test and replace only the faulty 8 GB stick.

What limit appears first under sustained heavy load?

The CL11 latency at 1600 MHz and 1.35 V sets the throughput ceiling before thermal throttling becomes a factor.

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