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Green circuit board with black chips and gold edge connector

Team Group

Team Group TED21G800C6-S01 1GB DDR2 PC2-6400 800MHz SO-DIMM laptop RAM

SKU CH-975Z-R96XF MPN TED21G800C6-S01

1 GB DDR2 laptop SO-DIMM running at 800 MHz with CL6 latency and 5.4 GB/s bandwidth

  • 1 GB capacity upgrades older DDR2 laptops
  • 800 MHz DDR2 speed delivers 5.4 GB/s bandwidth
  • CL6 latency improves responsiveness in legacy systems
  • 200-pin SO-DIMM form factor fits compatible notebook slots
  • 8 V operation with unbuffered non-ECC design

Capacity and form factor

This is a single 1GB DDR2 SO-DIMM module built for laptops that accept 200-pin DDR2 memory. It runs at 800MHz with a CAS latency of CL6 and operates at the standard 1.8V. The non-ECC, unbuffered design suits mainstream notebook platforms from the DDR2 era.

Retail packaging and PCB

The module ships in retail packaging rather than a bare tray, which helps protect the 6-layer PCB during handling. The board uses a double-sided layout with eight 128Mx8 BGA chips, four per side, to achieve the stated density. No additional software, cables or cooling accessories are included.

Bandwidth ceiling and generation limit

The PC2-6400 rating delivers a maximum theoretical bandwidth of 5.4GB/s, which is the ceiling for the DDR2 interface used here. Systems requiring higher throughput, larger capacities per slot, or the lower voltages of later DDR generations cannot use this module.

Punti di forza

  • 1 GB capacity upgrades older DDR2 laptops
  • 800 MHz DDR2 speed delivers 5.4 GB/s bandwidth
  • CL6 latency improves responsiveness in legacy systems
  • 200-pin SO-DIMM form factor fits compatible notebook slots
  • 8 V operation with unbuffered non-ECC design

Caratteristiche tecniche

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Domande su questo articolo

Will the 1.8 V voltage requirement mean I need a different module if I upgrade to a newer laptop later?

This module runs at 1.8 V and uses the DDR2 standard with a 200-pin SO-DIMM form factor, so it will not fit the slots used in later laptops and a platform change will require new memory.

Does the CL6 latency at 800 MHz become a bottleneck before the 5.4 GB/s bandwidth limit is reached?

The module is rated at 800 MHz with CL6 latency and delivers 5.4 GB/s bandwidth; under sustained loads the latency is the characteristic that limits responsiveness before the bandwidth ceiling is hit.

How much heat does the double-sided 128Mx8 BGA layout produce when the module runs all day at 1.8 V?

The double-sided design with eight 128Mx8 BGA chips operates at the standard 1.8 V, so heat output stays within normal DDR2 SO-DIMM limits for continuous operation.

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