Bean Thermal Pad 12.8 W/mK 85x45x0.5mm

What this thermal pad does

This thermal pad provides a 12.8 W/mK thermal conductivity rating to bridge gaps between heat sources and heatsinks. It is designed for CPUs, GPUs, laptop heatsinks, LED coolers and various electronic control boards. The non-conductive silicone material ensures safe contact with electrical traces without risk of short circuits. It suits builders and technicians needing reliable gap-filling thermal interface material.

How it fits into a build

The pad measures 85x45x0.5mm and can be cut freely to match specific component dimensions. It replaces traditional thermal grease paste, eliminating mess and ensuring consistent coverage across uneven surfaces. The material compresses to fill microscopic air gaps that impede heat transfer between the component and cooler. No curing time is required, so assembly can proceed immediately after placement.

Thermals noise and power

The pad operates reliably across a temperature range of -40 to 200 degrees Celsius without melting or degrading. It produces no noise as it contains no moving parts and draws zero power during operation. Fire-retardant and anti-corrosion properties maintain performance stability under sustained high-temperature loads. The silicone construction resists wear and compression set for long-term thermal consistency.