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Rectangular grey thermal pad, 85 by 45 by 0.5 mm

Bean

Bean Thermal Pad 12.8 W/mK 85x45x0.5mm

SKU CH-31PC-CPG5P

High-conductivity 12.8 W/mK silicone pad fills gaps between chips and heatsinks, insulates electrically, withstands -40 to 200 °C, and cuts to size for CPU, GPU or LED cooling

  • High 12.8 W/mK conductivity moves heat fast
  • Non-conductive silicone prevents electrical shorts
  • Withstands -40 °C to 200 °C without melting
  • Soft 0.5 mm pad cuts to fit any gap
  • Replaces messy paste on CPU GPU LED boards

What this thermal pad does

This thermal pad provides a 12.8 W/mK thermal conductivity rating to bridge gaps between heat sources and heatsinks. It is designed for CPUs, GPUs, laptop heatsinks, LED coolers and various electronic control boards. The non-conductive silicone material ensures safe contact with electrical traces without risk of short circuits. It suits builders and technicians needing reliable gap-filling thermal interface material.

How it fits into a build

The pad measures 85x45x0.5mm and can be cut freely to match specific component dimensions. It replaces traditional thermal grease paste, eliminating mess and ensuring consistent coverage across uneven surfaces. The material compresses to fill microscopic air gaps that impede heat transfer between the component and cooler. No curing time is required, so assembly can proceed immediately after placement.

Thermals noise and power

The pad operates reliably across a temperature range of -40 to 200 degrees Celsius without melting or degrading. It produces no noise as it contains no moving parts and draws zero power during operation. Fire-retardant and anti-corrosion properties maintain performance stability under sustained high-temperature loads. The silicone construction resists wear and compression set for long-term thermal consistency.

Pontos fortes

  • High 12.8 W/mK conductivity moves heat fast
  • Non-conductive silicone prevents electrical shorts
  • Withstands -40 °C to 200 °C without melting
  • Soft 0.5 mm pad cuts to fit any gap
  • Replaces messy paste on CPU GPU LED boards

Especificações

Ainda não há especificações publicadas para este artigo.

Perguntas sobre este artigo

How thick is the 0.5 mm pad before it compresses under the heatsink?

The pad is supplied at 0.5 mm thickness and compresses to fill the gap between the component and the heatsink for full contact.

Does the silicone material stay stable when the laptop GPU runs hot all day?

The pad is rated from -40 °C to 200 °C, non-conductive, fire-retardant and will not melt or degrade during continuous operation.

Will the 85 mm by 45 mm sheet cover my CPU die or do I need to buy a larger roll?

The sheet measures 85 mm by 45 mm and can be cut to size, so it suits most CPU, GPU, VRAM and VRM contact areas.

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