SanDisk SDSP82200TAH-000E0 Optimus GX PRO 8100 2TB internal SSD
- Internal Solid Stat…
- M.2 2280-S3-M
Prijímame kryptomeny — takže mince, ktoré držíte, môžete zameniť za skutočný hardvér.Plaťte v krypte, miňte ho na skutočný hardvér. Poistená doprava zadarmo po celom svete nad 399 $. Neutrálne kartóny bez potlače, odosielané z Nemecka.Poistená doprava zadarmo nad 399 $. Váš kurz je zablokovaný na 30 minút hneď po otvorení pokladne.Kurz zablokovaný na 30 minút. Každý produkt je zapečatený, jeho sériové číslo je overené a vzťahuje sa naň 24-mesačná záruka.Zapečatené, 24-mesačná záruka.
SanDisk
M.2 2280 8 TB internal SSD with PCIe 5.0 x4 interface, sequential read up to 14900 MB/s, write up to 13200 MB/s, 4800 TBW endurance and integrated heatsink
Option 8TB w/ Heatsink
The SanDisk Optimus GX PRO 8100 is an 8TB internal solid state drive built for professionals who need high-capacity, high-speed storage. It uses a PCIe 5.0 x4 interface with NVMe protocol and 3D NAND TLC memory. A low-profile anodised aluminium heatsink with RGB LED is integrated for thermal management.
This drive suits content creators, AI developers and enthusiasts handling massive project libraries and write-intensive workloads. The 4800 TBW endurance rating supports heavy sustained writing. Users with older motherboards lacking PCIe 5.0 x4 slots or those needing only modest capacity for general office work should consider lower-specification alternatives.
Under continuous heavy workloads the integrated heatsink helps maintain performance during intense workflows. Average active power draw is 7.1W for reads and 7.3W for writes while idle consumption is 5 mW. The drive operates between 0°C and 85°C with an MTBF of 1,750,000 hours.
| Brand | SanDisk |
|---|---|
| Series | Optimus GX PRO 8100 |
| Model | SDSP82800TAH-000E0 |
| Device Type | Internal Solid State Drive (SSD) |
| Form Factor | M.2 2280-D5-M |
| Capacity | 8TB |
| Memory Components | 3D NAND TLC |
| Interface | PCI-Express 5.0 x4 |
| Protocol | NVMe 2.0 |
| Max Sequential Read | Up to 14900 MBps |
| Max Sequential Write | Up to 13200 MBps |
| 4KB Random Read | Up to 2,200,000 IOPS |
| 4KB Random Write | Up to 2,400,000 IOPS |
| Terabytes Written (TBW) | 4800TB |
| MTBF | 1,750,000 hours |
| HeatSink | with HeatSink |
| Power Consumption (Idle) | 5 mW |
| Power Consumption (Active) | Average Active Power Read: 7.1W Average Active Power Write: 7.3W |
| Operating Temperature | 0°C ~ +85°C |
| Storage Temperature | -40°C ~ +85°C |
| Max Shock Resistance | 1,500G @ 0.5 ms half-sine |
| Max Vibration Resistance | Operating Vibration: 5 gRMS, 10-2000 Hz, 3 axes Non-operating Vibration: 4.9 gRMS, 7-800 Hz, 3 axes |
| Height | 11.25mm |
| Width | 25mm |
| Depth | 80mm |
| Weight | 30.4g |
| Prepravná hmotnosť | 0.05 kg |
| Rozmery balenia | 127 × 102 × 1 mm |
Ďalšie verzie tohto modelu
Rovnaký rad, iná pamäť, chladič alebo frekvencia — porovnajte pred rozhodnutím.
Yes, the drive uses an M.2 2280-D5-M form factor and requires a PCIe 5.0 x4 NVMe 2.0 slot to reach its rated 14,900 MBps read and 13,200 MBps write speeds.
The anodized aluminum heatsink adds 11.25 mm of height above the PCB, so clearance depends on your specific motherboard layout and graphics card backplate thickness.
Run a 4 KB random read test at queue depth 32 using a tool such as CrystalDiskMark or FIO and compare the result to the 2,200,000 IOPS specification.
Aj v tomto oddelení
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