Supermicro
Supermicro MBD-X12DPI-NT6-O server motherboard
Extended ATX server board for dual 3rd Gen Intel Xeon Scalable CPUs with 18 DDR4-3200 slots up to 4 TB, four PCIe 4.0 x16, two PCIe 4.0 x8, 14 SATA 6.0 Gb/s ports.
- CPU Socket TypeLGA 4189
- CPU TypeSupports Dual 3rd Gen Intel Xeon Scalable processors
- North BridgeIntel C621A
- Number of DDR4 Slots18 x 288-pin
- DDR4 StandardDDR4 3200
- Maximum Memory Supported4TB
- Dual 3rd Gen Intel Xeon Scalable processors supported
- 18 DDR4 3200 slots enable up to 4 TB ECC memory
- Four PCIe 4.0 x16 and two PCIe 4.0 x8 slots for high-speed add-in cards
- Dual Intel X550 controllers deliver two 10 Gbps LAN ports
- 14 SATA 6.0 Gb/s ports with RAID 0/1/5/10 for dense storage
Dual-socket Xeon server board
The Supermicro MBD-X12DPI-NT6-O is an Extended ATX motherboard built for dual 3rd Gen Intel Xeon Scalable processors in LGA 4189 sockets. It targets datacentre builds that need high core counts and large memory capacity in a 12 x 13 inch form factor. The Intel C621A chipset links up to 4 TB of DDR4 3200 ECC memory across eighteen 288-pin slots. Buyers who only need a single processor or consumer-grade memory should look elsewhere.
Thermal and power envelope
Each socket supports CPUs up to 270 W TDP with three UPI links running at 11.2 GT/s, so adequate airflow across the VRM and DIMM areas is essential. The board draws power through standard EPS connectors and distributes it to eighteen DDR4 slots, four PCIe 4.0 x16 slots and two PCIe 4.0 x8 slots. No onboard fan headers or acoustic specifications are provided in the manufacturer data. Systems without forced-air chassis cooling will not meet the thermal demands of fully populated configurations.
Expansion and connectivity extras
Fourteen SATA 6.0 Gb/s ports with RAID 0, 1, 5 and 10 support high-density storage arrays. A single M.2 M-key slot accepts 2280 or 22110 modules over a PCIe 4.0 x4 link. Dual Intel X550 controllers deliver two 10 Gbps Ethernet ports for fast fabric connectivity. The Aspeed AST2600 provides VGA output on both rear and front headers, while five USB 3.2 Gen 1 ports and two USB 2.0 headers handle peripheral and management connections. Builds requiring additional M.2 slots or onboard Wi-Fi must add expansion cards.
จุดเด่น
- Dual 3rd Gen Intel Xeon Scalable processors supported
- 18 DDR4 3200 slots enable up to 4 TB ECC memory
- Four PCIe 4.0 x16 and two PCIe 4.0 x8 slots for high-speed add-in cards
- Dual Intel X550 controllers deliver two 10 Gbps LAN ports
- 14 SATA 6.0 Gb/s ports with RAID 0/1/5/10 for dense storage
ข้อมูลจำเพาะ
| Brand | SUPERMICRO |
|---|---|
| Model | MBD-X12DPI-NT6-O |
| CPU Socket Type | LGA 4189 |
| CPU Type | Supports Dual 3rd Gen Intel Xeon Scalable processors |
| North Bridge | Intel C621A |
| Number of DDR4 Slots | 18 x 288-pin |
| DDR4 Standard | DDR4 3200 |
| Maximum Memory Supported | 4TB |
| ECC Supported | Yes |
| PCI Express 4.0 x16 | 4 |
| PCI Express x8 | 2 x PCI Express 4.0 x8 |
| SATA | 14 x SATA 6.0Gb/s |
| SATA RAID | 0/1/5/10 |
| M.2 | M.2 Interface: 1 PCI-E 4.0 x4 Form Factor: 2280/22110 Key: M-Key |
| Onboard Video Chipset | Aspeed AST2600 |
| LAN Chipset | Intel X550 |
| LAN Speed | 10Gbps |
| Second LAN Chipset | Intel X550 |
| Second LAN Speed | 10Gbps |
| Max LAN Speed | 2 x 10Gbps |
| COM | 2 x COM Ports (1 rear, 1 header) |
| Video Ports | 2 VGA (1 rear bezel, 1 front panel) |
| USB 3.0 | 5 x USB 3.2 Gen1 (4 rear, 1 Type A) |
| Onboard USB | 2 x USB 2.0 (via headers) 2 x USB 3.2 Gen 1 (via headers) |
| Form Factor | Extended ATX |
| Dimensions (W x L) | 12" x 13" |
| น้ำหนักในการจัดส่ง | 2.18 kg |
| ขนาดบรรจุภัณฑ์ | 432 × 352 × 98 mm |
คำถามเกี่ยวกับสินค้านี้
How do I install the dual LGA 4189 processors and what step is often missed?
Align each CPU with the socket triangle, lower the carrier, and torque the four captive nuts in a cross pattern; the step often missed is seating the narrow ILM load-plate tabs fully before torquing.
What maintenance will the onboard Aspeed AST2600 BMC require later?
The BMC firmware should be updated periodically via the web UI or IPMI tool to address security advisories and add feature support; no physical component replacement is scheduled.
What limit appears first when all 18 DDR4 3200 slots are populated under sustained load?
Memory subsystem power and signal integrity become the limiting factor before the 270 W per-socket CPU thermal ceiling is reached.
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