نقبل الدفع بالعملة المشفرة — لذلك يمكن للعملات الرقمية التي تملكها أن تشتري أجهزة حقيقية.ادفع بالعملة المشفرة، وأنفقها على أجهزة حقيقية. شحن مؤمن مجانا إلى كل أنحاء العالم لما يتجاوز 399 US$. صناديق شحن بسيطة بلا علامة تجارية، ترسل من ألمانيا.شحن مؤمن مجانا لما يتجاوز 399 US$. يُقفل سعرك لمدة 30 دقيقة بمجرد فتح صفحة الدفع.السعر مقفل لمدة 30 دقيقة. كل قطعة مختومة، ورقمها التسلسلي متحقق منه، ومشمولة بضمان 24 شهرا.مختوم، وبضمان 24 شهرا.

قائمة الرصد تسجيل الدخول
Extended ATX motherboard in black and red with copper heatpipe heatsink and water channel

ASUS

ASUS Maximus V FORMULA LGA 1155 Intel Z77 Motherboard

SKU CH-N1XB-EAFGQ

Extended ATX Z77 board with LGA 1155 socket, four DDR3 slots up to 32 GB, three PCIe 3.0 x16 slots and six SATA 6Gb/s ports

  • CPU Socket TypeLGA 1155
  • CPU TypeCore i7 / i5 / i3 / Pentium / Celeron (LGA1155)
  • Supported CPU TechnologiesTurbo Boost Technology 2.0
  • ChipsetIntel Z77
  • Onboard Video ChipsetSupported only by CPU with integrated graphic
  • Number of Memory Slots4×240pin
  • Supports Core i7, i5, i3, Pentium and Celeron processors on LGA 1155 socket
  • Z77 chipset enables DDR3 memory up to 2800 MHz overclocked across four slots
  • Three PCI Express 3.0 x16 slots allow multi-GPU configurations with flexible lane allocation
  • Six SATA 6Gb/s ports with RAID 0, 1, 5, 10 support for high-speed storage arrays
  • SupremeFX IV audio with 300 ohm headphone amplifier delivers eight-channel sound for gaming

Built for LGA 1155 CPUs

This motherboard accepts Intel Core i7, i5, i3, Pentium and Celeron processors on the LGA 1155 socket with Turbo Boost Technology 2.0 support. It targets enthusiasts building a high-end platform on the Intel Z77 chipset. The extended ATX layout provides room for multi-GPU configurations and advanced cooling.

DDR3 up to 2800 MT/s overclocked

Four 240-pin slots support dual-channel DDR3 memory at speeds from 1066 through 1600 natively and up to 2800 when overclocked. Maximum capacity is 32 GB across the four slots. This memory specification is the single figure that determines whether your existing kits or planned upgrades are compatible.

Hybrid heatsink with water channel

The Fusion Thermo heatsink combines a copper heatpipe with an integrated water-cooling channel and electroplated barb fittings for air or liquid thermal management. Onboard audio uses the SupremeFX IV chipset with an 8-channel design and a 300 ohm headphone amplifier. Wired networking runs at 10/100/1000 Mbps via an Intel controller.

أبرز المميزات

  • Supports Core i7, i5, i3, Pentium and Celeron processors on LGA 1155 socket
  • Z77 chipset enables DDR3 memory up to 2800 MHz overclocked across four slots
  • Three PCI Express 3.0 x16 slots allow multi-GPU configurations with flexible lane allocation
  • Six SATA 6Gb/s ports with RAID 0, 1, 5, 10 support for high-speed storage arrays
  • SupremeFX IV audio with 300 ohm headphone amplifier delivers eight-channel sound for gaming

المواصفات

BrandASUS
ModelMaximus V FORMULA
CPU Socket TypeLGA 1155
CPU TypeCore i7 / i5 / i3 / Pentium / Celeron (LGA1155)
Supported CPU TechnologiesTurbo Boost Technology 2.0
ChipsetIntel Z77
Onboard Video ChipsetSupported only by CPU with integrated graphic
Number of Memory Slots4×240pin
Memory StandardDDR3 2800(O.C.)/2666(O.C.)/2600(O.C.)/2400(O.C.)/2200(O.C.)/2133(O.C.)/1866(O.C.)/1600/1333/1066
Maximum Memory Supported32GB
Channel SupportedDual Channel
PCI Express 3.0 x163 (x16 or dual x8 or x8/x4/x4)
PCI Express x41 x PCI Express x4
PCI Express x13 x PCI Express x1
Mini Card Slots1 x mini-PCIe 2.0 x1
Serial ATA (SATA)6 x SATA 6Gb/s
SATA RAID2 x SATA 6Gb/s (red) and 2 x SATA 3Gb/s (black) Support RAID 0, 1, 5, 10
Audio ChipsetSupremeFX IV
Audio Channels8 Channels
Max LAN Speed10/100/1000Mbps
Wireless LANWiFi IEEE 802.11 a / b / g / n
BluetoothBluetooth V4.0 Bluetooth V3.0+HS
Back I/O Ports1 x DisplayPort / 1 x eSATA 3GB/S / 1 x HDMI / 1 x Optical S/PDIF Out / 4 x USB 2.0/1.1 / 4 x USB 3.0
HDMI1 x HDMI
DisplayPort1 x DisplayPort
USB 3.04 x USB 3.0
USB 1.1/2.04 x USB 2.0
eSATA1 x eSATA 3Gb/s
S/PDIF Out1 x Optical
S/PDIF In1 x Optical
Audio Ports5 Ports
Onboard USB2 x USB 3.0 + 4 x USB 2.0
Other Connectors2 x CPU Fan connector(s) (4 -pin) 3 x Chassis Fan connector(s) (4 -pin) 3 x Optional Fan connector(s) (4 -pin) 1 x S/PDIF out header(s) 1 x 24-pin EATX Power connector(s) 1 x 8-pin ATX 12V Power connector(s) 1 x 4-pin ATX 12V Power connector(s) 1 x Front panel audio connector(s) (AAFP) 1 x System panel(s) 1 x Slow Mode switch(es) 8 x ProbeIt Measurement Points 3 x Thermal sensor connector(s) 1 x LN2 Mode header(s) 1 x EZ Plug connector(s) (4-pin Molex power connector) 1 x Power-on button(s) 1 x Reset button(s) 1 x Go Button(s) 1 x mPCIe Combo header(s)
Form FactorExtended ATX
Dimensions (W x L)12" x 10.1"
Power Pin24 Pin
FeaturesLGA1155 socket for Intel 3rd/2nd Generation Core i7/ i5/ i3/ Pentium / Celeron Processors Intel Z77 Express Chipset Fusion Thermal SupremeFX IV GameFirst II/ Intel Gb LAN mPCIe Combo + dual-band Wi-Fi/Bluetooth 4.0
Package ContentsBulk Packaged Item, no accessories. No Backplate I/O Shield. Dealer warranty only.

أسئلة حول هذا المنتج

How does the 2800 MHz DDR3 rating translate to actual memory speed on this board?

The 2800 MHz figure is an overclocked profile; the board also supports 2666, 2600, 2400, 2200, 2133, 1866, 1600, 1333 and 1066 MHz DDR3 up to 32 GB in dual-channel mode.

What does the PCI Express 3.0 x16 layout cap for multi-GPU setups?

Three PCIe 3.0 x16 slots run at x16, dual x8 or x8/x4/x4, plus one PCIe x4 and three PCIe x1 slots for additional cards.

What clearance does the Fusion Thermo heatsink need around the CPU socket?

The Fusion Thermo heatsink integrates a copper heatpipe and a water-cooling channel with electroplated barb fittings, adding height around the LGA 1155 socket area.

أيضًا في هذا القسم

عملاء قارنوا هذه المنتجات

نفس القسم، ونفس صفحة الدفع — ثماني عملات رقمية وقفل سعر لمدة 30 دقيقة.