نقبل الدفع بالعملة المشفرة — لذلك يمكن للعملات الرقمية التي تملكها أن تشتري أجهزة حقيقية.ادفع بالعملة المشفرة، وأنفقها على أجهزة حقيقية. شحن مؤمن مجانا إلى كل أنحاء العالم لما يتجاوز 399 US$. صناديق شحن بسيطة بلا علامة تجارية، ترسل من ألمانيا.شحن مؤمن مجانا لما يتجاوز 399 US$. يُقفل سعرك لمدة 30 دقيقة بمجرد فتح صفحة الدفع.السعر مقفل لمدة 30 دقيقة. كل قطعة مختومة، ورقمها التسلسلي متحقق منه، ومشمولة بضمان 24 شهرا.مختوم، وبضمان 24 شهرا.

قائمة الرصد تسجيل الدخول
A square silver Intel Xeon processor with gold contacts and a green substrate visible on the underside

Intel

Intel Xeon W-1370P BX80708W1370P server processor

SKU CH-DPCC-K25CQ

Eight-core workstation processor with 16 threads, 3.6 GHz base frequency, 5.2 GHz max turbo and 16 MB cache for LGA 1200 platforms

  • NameXeon W-1370P
  • CPU Socket TypeLGA 1200
  • Core NameRocket Lake
  • # of Cores8-Core
  • # of Threads16
  • Operating Frequency3.6 GHz
  • 8 cores and 16 threads handle parallel workloads efficiently
  • Base frequency 3.6 GHz with turbo up to 5.2 GHz for responsive performance
  • 16 MB Intel Smart Cache reduces latency on large datasets
  • Integrated UHD Graphics P750 supports display output without a discrete card
  • 125 W TDP fits standard workstation cooling solutions

Xeon W-1370P 8-core workstation CPU

The Intel Xeon W-1370P is an 8-core, 16-thread server processor built on the 14 nm Rocket Lake architecture. It operates at a 3.6 GHz base frequency with a maximum turbo frequency of 5.2 GHz and includes 16 MB of L3 cache. The LGA 1200 package integrates Intel UHD Graphics P750 and supports dual-channel memory at 3200 MHz.

Suited for ECC workstations needing integrated

This processor targets workstation builds that require ECC memory support and integrated graphics for display output without a discrete card. It suits users who rely on Intel virtualisation technologies and a 125 W thermal envelope. Builders needing more than eight cores, higher memory-channel counts, or a discrete GPU-only platform should consider other Xeon families.

LGA 1200 socket with 125 W TDP

The decisive specification is the LGA 1200 socket combined with a 125 W TDP; the motherboard must provide this exact socket and adequate cooling for the rated power. The 16 MB Smart Cache and dual-channel 3200 MHz memory controller are fixed characteristics of this model.

أبرز المميزات

  • 8 cores and 16 threads handle parallel workloads efficiently
  • Base frequency 3.6 GHz with turbo up to 5.2 GHz for responsive performance
  • 16 MB Intel Smart Cache reduces latency on large datasets
  • Integrated UHD Graphics P750 supports display output without a discrete card
  • 125 W TDP fits standard workstation cooling solutions

المواصفات

BrandIntel
SeriesIntel Xeon W
NameXeon W-1370P
ModelBX80708W1370P
CPU Socket TypeLGA 1200
Core NameRocket Lake
# of Cores8-Core
# of Threads16
Operating Frequency3.6 GHz
Max Turbo Frequency5.2 GHz
L3 Cache16MB
64-Bit SupportYes
Hyper-Threading SupportYes
Manufacturing Tech14 nm
Integrated Memory Controller Speed3200 MHz
Memory ChannelDual Channel
Virtualization Technology SupportYes
Integrated GraphicsIntel UHD Graphics P750
Graphics Base Frequency350 MHz
Max Dynamic Frequency1.30 GHz
PCI Express Revision4.0
Max # of PCI Express Lanes20
Thermal Design Power125W

أسئلة حول هذا المنتج

Does the LGA 1200 socket require a specific cooler mounting pattern for this 125 W processor?

The CPU fits the standard LGA 1200 mounting holes; choose any cooler rated for at least 125 W and secure it evenly to avoid pressure gaps.

What BIOS setting often gets missed when installing the W-1370P on a fresh workstation board?

Enable the integrated UHD Graphics P750 in the firmware so the 350 MHz base GPU initialises and provides display output without a discrete card.

When should the thermal paste be refreshed on this 14 nm Rocket Lake chip under sustained load?

Reapply paste every two to three years or if temperatures climb above normal idle levels, using a thin, even layer across the heat spreader.

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