BFKK
BFKK 3U Rackmount Server Chassis EATX/ATX/MATX 4x5.25 6x3.5 Top/Side Cooling
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متوفر
NEMIX RAM
NEMIX RAM 8GB DDR4 2666MHz CL19 260-pin SODIMM Samsung compatible memory upgrade
8 GB DDR4 2666 MHz CL19 SODIMM module for compatible Samsung laptops and all-in-one PCs
- Capacity8GB
- SpeedDDR4 2666 (PC4 21300)
- ECCNo
- Buffered/RegisteredUnbuffered
- ChipsetMajor OEM Samsung, Micron, Hynix
- Voltage1.20V
- 8GB capacity expands multitasking headroom for daily workloads
- DDR4 2666MHz speed matches Samsung system specifications
- CL19 latency supports stable operation at rated frequency
- 20V low voltage reduces power draw in laptops
- 260-pin SODIMM form factor fits compatible Samsung notebooks
Samsung-compatible DDR4 SODIMM upgrade
This 8 GB DDR4 2666 MHz SODIMM is built for Samsung laptops and all-in-one PCs that accept 260-pin unbuffered non-ECC modules. It suits owners who need a straightforward capacity increase without changing voltage or latency settings.
Single-module 1Rx8 configuration
The stick ships alone as a 1Rx8 1.2 V unit with CL19 timing, so it plugs directly into an empty slot or replaces an existing module without requiring paired installation or BIOS tuning. No heat spreader is included, keeping the profile low for tight chassis.
CL19 latency at 2666 MHz
The CAS latency of 19 cycles at the rated 2666 MT/s speed determines how quickly the memory responds to requests; systems that require tighter timings or higher frequencies will not match this specification. Buyers who need lower latency or faster data rates should look elsewhere.
أبرز المميزات
- 8GB capacity expands multitasking headroom for daily workloads
- DDR4 2666MHz speed matches Samsung system specifications
- CL19 latency supports stable operation at rated frequency
- 20V low voltage reduces power draw in laptops
- 260-pin SODIMM form factor fits compatible Samsung notebooks
المواصفات
| Brand | NEMIX RAM |
|---|---|
| Series | Samsung Laptop, AIO All-in-One PC Compatible Series Memory |
| Model | Samsung DDR4 2666MHZ Non-ECC Unbuffered SODIMM |
| Part Number | MS21300-818K1 |
| Capacity | 8GB |
| Speed | DDR4 2666 (PC4 21300) |
| ECC | No |
| Buffered/Registered | Unbuffered |
| Chipset | Major OEM Samsung, Micron, Hynix |
| Voltage | 1.20V |
| Compatible System | Samsung |
| CAS Latency | CL19 |
| Heat Spreader | No |
| Type | 260-Pin DDR4 SODIMM |
| Rank | 1Rx8 |
| Features | DDR4 Non-ECC Unbuffered SODIMM Motherboard Compatible |
| Package Content | 8GB (1X8GB) DDR4 2666MHZ PC4-21300 1Rx8 1.2V CL19 260-PIN Non-ECC Unbuffered SODIMM |
أسئلة حول هذا المنتج
Will the 1Rx8 rank configuration need any firmware updates or matching modules if I add another stick later?
The module is a single-rank 1Rx8 design, so adding a second identical stick keeps the memory controller in dual-channel mode without requiring firmware changes or matched kits.
Does the CL19 latency at 2666 MHz become a bottleneck before the 1.20 V power limit on long workloads?
At DDR4 2666 the CAS 19 timing is the first constraint you hit; the 1.20 V supply stays within spec well before latency limits sustained throughput.
How hot does the bare PCB get without a heat spreader when the laptop runs all day?
Without a spreader the chips rely on chassis airflow; at 1.20 V typical SODIMM temperatures stay under 60 °C in normal laptop ventilation.
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