Přijímáme kryptoměny — takže to, co držíte, můžete utratit za skutečný hardware.Plaťte kryptem, utrácejte ho za skutečný hardware. Pojištěná doprava zdarma po celém světě nad 399 $. Neutrální přepravní krabice bez loga, odesílané z Německa.Pojištěná doprava zdarma nad 399 $. Jakmile se otevře pokladna, je váš kurz zablokovaný na 30 minut.Kurz zablokovaný na 30 minut. Každý výrobek je zapečetěný, jeho sériové číslo je zkontrolované a vztahuje se na něj 24měsíční záruka.Zapečetěno, záruka 24 měsíců.

Sledované položky Přihlásit se
Four low-profile DDR3 sticks with dark grey heat spreaders

G.SKILL

G.SKILL Ares F3-1600C9Q-16GAO 16GB (4×4GB) DDR3 1600 CL9 desktop RAM

SKU CH-YXKA-701S6 MPN F3-1600C9Q-16GAO

Quad-channel 16GB DDR3 1600 kit with CL9 timing, 1.50V operation and 3.2cm low-profile heat spreaders

  • Capacity16GB (4 x 4GB)
  • SpeedDDR3 1600 (PC3 12800)
  • CAS LatencyCL9
  • Timing9-9-9
  • Voltage1.50V
  • ECCNo
  • 16 GB quad-channel kit for high multitasking capacity
  • DDR3 1600 CL9 timing for responsive system performance
  • 50 V standard voltage for broad platform compatibility
  • 2 cm low-profile heat spreader fits large CPU coolers
  • Intel XMP support on LGA1155, LGA1156 and LGA2011 platforms

G.SKILL Ares 16GB Quad-Channel Kit

This G.SKILL Ares kit delivers 16GB of DDR3 memory in a matched set of four 4GB modules. It runs at 1600MHz with a CAS latency of CL9 and timings of 9-9-9 at 1.50V. The low-profile heat spreader measures 3.2cm tall and fits beneath large CPU coolers or inside compact cases.

Suited for DDR3 systems needing 16GB across four

The quad-channel kit targets Intel LGA1155, LGA1156 and LGA2011 platforms plus AMD AM3, AM3+ and Llano sockets with Intel XMP support for 1st, 2nd and 3rd Generation Core processors. It is not for buyers who need ECC error correction, registered modules or capacities beyond 16GB. Systems limited to dual-channel architectures should look at dual-channel kits instead.

3.2cm low-profile heat spreader height

At only 3.2cm tall, the heat spreader clears oversized tower coolers and fits small-form-factor builds where standard-height modules would collide with the CPU cooler. This single dimension decides whether the kit fits your chassis and cooler combination.

Přednosti

  • 16 GB quad-channel kit for high multitasking capacity
  • DDR3 1600 CL9 timing for responsive system performance
  • 50 V standard voltage for broad platform compatibility
  • 2 cm low-profile heat spreader fits large CPU coolers
  • Intel XMP support on LGA1155, LGA1156 and LGA2011 platforms

Specifikace

BrandG.SKILL
SeriesAres Series
ModelF3-1600C9Q-16GAO
Capacity16GB (4 x 4GB)
SpeedDDR3 1600 (PC3 12800)
CAS LatencyCL9
Timing9-9-9
Voltage1.50V
ECCNo
Buffered/RegisteredUnbuffered
Multi-channel KitQuad Channel Kit
Heat SpreaderYes
FeaturesCompatible with Intel LGA1155/LGA1156/LGA2011 and AMD AM3/Llano/AM3+ platforms
Intel XMP support for 1st, 2nd and 3rd Generation Intel Core Processors
Přepravní hmotnost0.17 kg
Rozměry balení208 × 127 × 10 mm

Otázky k tomuto produktu

Does this kit need a motherboard with four DDR3 slots to install all 16GB?

Yes, the 4×4GB quad-channel kit occupies four DDR3 slots, so the board must provide four compatible slots.

Will these modules fit under a large CPU cooler in an LGA1155 build?

The heat spreader is only 3.2cm tall, leaving clearance for most oversized air coolers on LGA1155 boards.

How can I confirm the memory is running at 1600MHz with CL9 timing after enabling XMP?

Enter the BIOS or use a tool like CPU-Z; the SPD tab should show DDR3-1600, 9-9-9 timings and 1.50V when XMP is active.

Také v této kategorii

Zákazníci také porovnávali

Stejná kategorie, stejná pokladna — osm měn a kurz zamčený na 30 minut.