BFKK
BFKK 3U Rackmount Server Chassis EATX/ATX/MATX 4x5.25 6x3.5 Top/Side Cooling
- Rackmount
US$214.99
0.00276586BTC
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G.SKILL
G.SKILL Ares F3-1600C9Q-16GAO 16GB (4×4GB) DDR3 1600 CL9 desktop RAM
Quad-channel 16GB DDR3 1600 kit with CL9 timing, 1.50V operation and 3.2cm low-profile heat spreaders
- Capacity16GB (4 x 4GB)
- SpeedDDR3 1600 (PC3 12800)
- CAS LatencyCL9
- Timing9-9-9
- Voltage1.50V
- ECCNo
- 16 GB quad-channel kit for high multitasking capacity
- DDR3 1600 CL9 timing for responsive system performance
- 50 V standard voltage for broad platform compatibility
- 2 cm low-profile heat spreader fits large CPU coolers
- Intel XMP support on LGA1155, LGA1156 and LGA2011 platforms
G.SKILL Ares 16GB Quad-Channel Kit
This G.SKILL Ares kit delivers 16GB of DDR3 memory in a matched set of four 4GB modules. It runs at 1600MHz with a CAS latency of CL9 and timings of 9-9-9 at 1.50V. The low-profile heat spreader measures 3.2cm tall and fits beneath large CPU coolers or inside compact cases.
Suited for DDR3 systems needing 16GB across four
The quad-channel kit targets Intel LGA1155, LGA1156 and LGA2011 platforms plus AMD AM3, AM3+ and Llano sockets with Intel XMP support for 1st, 2nd and 3rd Generation Core processors. It is not for buyers who need ECC error correction, registered modules or capacities beyond 16GB. Systems limited to dual-channel architectures should look at dual-channel kits instead.
3.2cm low-profile heat spreader height
At only 3.2cm tall, the heat spreader clears oversized tower coolers and fits small-form-factor builds where standard-height modules would collide with the CPU cooler. This single dimension decides whether the kit fits your chassis and cooler combination.
주요 특징
- 16 GB quad-channel kit for high multitasking capacity
- DDR3 1600 CL9 timing for responsive system performance
- 50 V standard voltage for broad platform compatibility
- 2 cm low-profile heat spreader fits large CPU coolers
- Intel XMP support on LGA1155, LGA1156 and LGA2011 platforms
사양
| Brand | G.SKILL |
|---|---|
| Series | Ares Series |
| Model | F3-1600C9Q-16GAO |
| Capacity | 16GB (4 x 4GB) |
| Speed | DDR3 1600 (PC3 12800) |
| CAS Latency | CL9 |
| Timing | 9-9-9 |
| Voltage | 1.50V |
| ECC | No |
| Buffered/Registered | Unbuffered |
| Multi-channel Kit | Quad Channel Kit |
| Heat Spreader | Yes |
| Features | Compatible with Intel LGA1155/LGA1156/LGA2011 and AMD AM3/Llano/AM3+ platforms Intel XMP support for 1st, 2nd and 3rd Generation Intel Core Processors |
| 배송 무게 | 0.17 kg |
| 포장 크기 | 208 × 127 × 10 mm |
이 상품에 대한 질문
Does this kit need a motherboard with four DDR3 slots to install all 16GB?
Yes, the 4×4GB quad-channel kit occupies four DDR3 slots, so the board must provide four compatible slots.
Will these modules fit under a large CPU cooler in an LGA1155 build?
The heat spreader is only 3.2cm tall, leaving clearance for most oversized air coolers on LGA1155 boards.
How can I confirm the memory is running at 1600MHz with CL9 timing after enabling XMP?
Enter the BIOS or use a tool like CPU-Z; the SPD tab should show DDR3-1600, 9-9-9 timings and 1.50V when XMP is active.
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