Přijímáme kryptoměny — takže to, co držíte, můžete utratit za skutečný hardware.Plaťte kryptem, utrácejte ho za skutečný hardware. Pojištěná doprava zdarma po celém světě nad 399 $. Neutrální přepravní krabice bez loga, odesílané z Německa.Pojištěná doprava zdarma nad 399 $. Jakmile se otevře pokladna, je váš kurz zablokovaný na 30 minut.Kurz zablokovaný na 30 minut. Každý výrobek je zapečetěný, jeho sériové číslo je zkontrolované a vztahuje se na něj 24měsíční záruka.Zapečetěno, záruka 24 měsíců.

Sledované položky Přihlásit se
Large rectangular EATX motherboard with dark metallic heatsinks and silver accents

GIGABYTE

GIGABYTE X670E AORUS XTREME AMD motherboard

SKU CH-23PQ-RYWGD

Supports Ryzen 7000 CPUs on AM5 socket with DDR5 memory, 18+2+2 phase VRM, PCIe 5.0, quad M.2 slots, WiFi 6E, 2.5G LAN and USB 3.2

  • CPU TypeRyzen 7000 Series
  • ChipsetAMD X670E
  • Supports AMD Ryzen 7000 Series processors via AM5 socket
  • Direct 18+2+2 phases digital VRM with 8-layer 2X copper PCB
  • Fins-Array III heatsink with NanoCarbon coating plus M.2 Thermal Guard III
  • PCIe 5.0 and quad NVMe x4 M.2 slots with EZ-Latch Plus screwless design
  • AQUANTIA 10GbE LAN and Intel WiFi 6E 802.11ax connectivity

AM5 Platform Foundation

This EATX motherboard uses the AMD X670E chipset and the AM5 socket with 1718 contacts to support Ryzen 7000 series processors. The 18+2+2 phase digital VRM on an 8-layer PCB with doubled copper is built for sustained high-current delivery.

DDR5 Memory Capacity

Four SMD DIMM slots accept unbuffered DDR5 modules with or without ECC and are rated for overclocked speeds up to 8000 MHz. This configuration sets the maximum memory ceiling for the build.

Thermal Behaviour Under Load

The Fins-Array III heatsink with NanoCarbon coating works with the M.2 Thermal Guard III and a NanoCarbon aluminium backplate to dissipate VRM and storage heat during extended workloads. The 10 GbE and 2.5 GbE network controllers maintain throughput without thermal throttling.

Přednosti

  • Supports AMD Ryzen 7000 Series processors via AM5 socket
  • Direct 18+2+2 phases digital VRM with 8-layer 2X copper PCB
  • Fins-Array III heatsink with NanoCarbon coating plus M.2 Thermal Guard III
  • PCIe 5.0 and quad NVMe x4 M.2 slots with EZ-Latch Plus screwless design
  • AQUANTIA 10GbE LAN and Intel WiFi 6E 802.11ax connectivity

Specifikace

BrandGIGABYTE
ModelX670 AORUS ELITE AX
CPU TypeRyzen 7000 Series
ChipsetAMD X670E

Otázky k tomuto produktu

What does the 18+2+2 phase VRM design mean for a Ryzen 7000 CPU under load?

The 18+2+2 digital power phases on an 8-layer 2X copper PCB deliver stable current to the CPU socket, keeping voltage steady during heavy multi-core workloads.

How does the PCIe 5.0 slot and four M.2 connectors affect storage speed limits?

One PCIe 5.0 x16 slot and four M.2 sockets wired for PCIe 4.0 x4 each let you run a Gen5 GPU and up to four Gen4 NVMe drives at full bandwidth simultaneously.

What clearance does the EATX board and Fins-Array III heatsink need in a case?

The EATX form factor requires a case that supports the larger footprint, while the Fins-Array III VRM heatsink with NanoCarbon coating adds height above the socket area for airflow.

Také v této kategorii

Zákazníci také porovnávali

Stejná kategorie, stejná pokladna — osm měn a kurz zamčený na 30 minut.