NEMIX RAM DDR5-5600 2TB (16x128GB) ECC RDIMM CL46 1.1V Supermicro H14SST-G memory upgrade
- 2TB (16 x 128GB)
- 288-Pin DDR5 RDIMM
Přijímáme kryptoměny — takže to, co držíte, můžete utratit za skutečný hardware.Plaťte kryptem, utrácejte ho za skutečný hardware. Pojištěná doprava zdarma po celém světě nad 399 $. Neutrální přepravní krabice bez loga, odesílané z Německa.Pojištěná doprava zdarma nad 399 $. Jakmile se otevře pokladna, je váš kurz zablokovaný na 30 minut.Kurz zablokovaný na 30 minut. Každý výrobek je zapečetěný, jeho sériové číslo je zkontrolované a vztahuje se na něj 24měsíční záruka.Zapečetěno, záruka 24 měsíců.
Intel
36-core Xeon desktop processor with 72 threads, 67.5 MB L3 cache, 2.0 GHz base and 3.2 GHz turbo, supporting DDR5 4800 MT/s across eight channels up to 4 TB with ECC
The Intel Xeon Platinum 8452Y is a 36-core desktop CPU built on the 10nm Sapphire Rapids architecture. It operates at a 2.0 GHz base frequency and reaches a 3.2 GHz maximum turbo frequency. The processor supports 72 threads and provides 67.5MB of L3 cache within a 300W thermal design power envelope. It fits the LGA 4677 socket and includes an integrated memory controller running at 4800 MHz.
This processor suits dual-socket servers and high-core-count workstations that need 72 threads and eight-channel DDR5 memory with ECC support. It also provides 80 PCI Express 5.0 lanes and Intel AMX for matrix acceleration. Buyers who require a lower thermal design power, a single-socket platform, or a different core count should evaluate other models.
The 300W thermal design power is the key specification that determines whether this part fits the cooling and power infrastructure of the target system. A compatible LGA 4677 motherboard and a cooling solution rated for at least 300W are mandatory. No cooling device is included with the processor.
| Brand | Intel |
|---|---|
| Processors Type | Desktop |
| Series | Xeon |
| Name | Xeon Platinum 8452Y |
| Model | PK8071305076101 |
| CPU Socket Type | LGA 4677 |
| Core Name | Sapphire Rapids |
| # of Cores | 36-Core |
| # of Threads | 72-Threads |
| Operating Frequency | 2.0 GHz |
| Max Turbo Frequency | 3.2 GHz |
| L3 Cache | 67.5MB |
| Manufacturing Tech | 10nm |
| Instruction Set | 64-Bit |
| Integrated Memory Controller Speed | 4800 MHz |
| Memory Types | Up to DDR5 4800 MT/s 1DPC Up to DDR5 4400 MT/s 2DPC |
| Memory Channel | 8 |
| Max Memory Size | 4TB |
| ECC Memory | Supported |
| Virtualization Technology Support | Yes |
| Scalability | 2S |
| PCI Express Revision | 5.0 |
| Max Number of PCI Express Lanes | 80 |
| Multimedia Instruction | Intel AMX, Intel SSE4.2, Intel AVX, Intel AVX2, Intel AVX-512 |
| Thermal Design Power | 300W |
| Cooling Device | Cooling device not included - Processor Only |
| Advanced Technologies | Intel On Demand Activation Model: No Intel Data Streaming Accelerator (DSA): 1 default devices Intel Advanced Matrix Extensions (AMX): Yes Intel Speed Select Technology - Core Power: Yes Intel Speed Select Technology - Turbo Frequency: Yes Intel Deep Learning Boost (Intel DL Boost) on CPU: Yes Intel Speed Select Technology - Performance Profile: Yes Intel Speed Select Technology - Base Frequency: Yes High Priority Cores: 12 High Priority Core Frequency: 2.20 GHz Low Priority Cores: 24 Low Priority Core Frequency: 1.80 GHz Intel Resource Director Technology (Intel RDT): Yes Intel Spee |
| Security & Reliability | Intel Crypto Acceleration: Yes Intel QuickAssist Software Acceleration: Yes Intel Platform Firmware Resilience Support: Yes Intel Control-Flow Enforcement Technology: Yes Intel Total Memory Encryption: Yes Intel AES New Instructions: Yes Intel Software Guard Extensions (Intel SGX): Yes with Intel SPS Default Maximum Enclave Page Cache (EPC) Size for Intel SGX: 128 GB Intel OS Guard: Yes Intel Trusted Execution Technology: Yes Execute Disable Bit: Yes Intel Boot Guard: Yes Intel Run Sure Technology: Yes Mode-based Execute Control (MBEC): Yes Intel Virtualization Technology (VT-x): Yes |
| Přepravní hmotnost | 0.23 kg |
| Rozměry balení | 127 × 102 × 25 mm |
The processor fits an LGA 4677 socket and draws up to 300 W, so the motherboard must supply that power through the CPU VRM.
Align the notches, lower the chip without tilting, then torque the independent loading mechanism in a cross pattern to the board-maker's spec — skipping the cross pattern leaves uneven contact.
No cooler is included; plan to clean the heatsink fins and replace the thermal interface material every one to two years to sustain 300 W dissipation.
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