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Ultra-compact fanless ITX case with 21 mm aluminium heat sink and sandblasted anodised finish

Streacom

Streacom DB1 Fanless ITX PC Case 21 mm 45 W

SKU CH-YT43-75GXV

An ultra-compact fanless ITX case built from thick aluminium with a 21 mm heat sink, dissipating 45 W for APU-based systems

  • TypeATX / Micro ATX Mid Tower
  • Fanless 45 W cooling keeps APU builds silent
  • Ultra-compact sub-5 L chassis fits tight spaces
  • 21 mm extruded aluminium heatsink dissipates heat passively
  • 4 mm aluminium panels with CNC-milled, anodised finish
  • Premium materials and construction at a competitive price

Ultra-compact fanless ITX case

The Streacom DB1 is an ultra-compact fanless ITX chassis built from 4 mm aluminium panels and a 21 mm extruded heat sink. It handles up to 45 W of passive cooling, making it suited for power-efficient APU or IGPU systems. CNC-milled construction with sandblasted anodised finish keeps the design clean and rigid.

Simple screw-together assembly

The case uses solid aluminium rods that thread through the panels, so installation is a matter of aligning components and tightening screws. No fans or liquid loops are involved, removing cable routing and vibration concerns. The tight internal volume means tall CPU coolers, long GPUs or extra drives will not fit, so plan a minimal parts list.

Check APU power and board layout

Verify your chosen APU or IGPU stays at or below the 45 W passive limit, otherwise temperatures will rise. Confirm the ITX motherboard has no components that protrude into the heat-sink contact area. Builders needing discrete graphics, multiple storage bays or high-wattage CPUs should look elsewhere.

Přednosti

  • Fanless 45 W cooling keeps APU builds silent
  • Ultra-compact sub-5 L chassis fits tight spaces
  • 21 mm extruded aluminium heatsink dissipates heat passively
  • 4 mm aluminium panels with CNC-milled, anodised finish
  • Premium materials and construction at a competitive price

Specifikace

TypeATX / Micro ATX Mid Tower

Otázky k tomuto produktu

How can I confirm the DB1 is dissipating heat correctly after building my system?

Monitor CPU temperatures under load; the aluminium chassis and 21 mm heat sink are rated for 45 W so thermals should stay within the processor’s specified limits.

What comes with the DB1 and what must I source separately?

The case includes the aluminium panels, extruded heat sink and mounting rods; you will need to supply an ITX motherboard, APU/IGPU, memory, storage and power supply.

Which DB1 variant should I choose for a 45 W APU build?

The single DB1 model is engineered for up to 45 W cooling, making it the appropriate choice for power-efficient APU or IGPU systems.

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