coxbyte
coxbyte TG-30 thermal paste 17.5 W/mK 4g
High-conductivity 17.5 W/mK paste cuts CPU/GPU core temperatures by 20 °C and stays stable from −50 °C to 250 °C
- Volume / Net Weight4g
- Thermal Conductivity17.5 W/mK
- Long Term Operating Temperature-50 to 250 C
- SpecificationsTG-30 adopts an improved nanocarbon tube composite formula w
Weight 4g
- 4g
- 2 g
- High thermal conductivity of 17.5 W/mK cuts core temperatures
- Non-conductive formula prevents short circuits on CPU and GPU
- Stable from -50 °C to 250 °C without drying out
- Less than 3 % degradation over five years extends service life
- Smooth silicone texture allows easy, even application
High-conductivity thermal paste
Coxbyte TG-30 is a 4 g tube of non-conductive thermal compound rated at 17.5 W/mK. The nanocarbon tube composite formula fills microscopic gaps between dies and heat-spreaders to lower core temperatures. It remains stable from -50 °C to 250 °C without drying out or volatilising.
Overclockers and server builders
Enthusiasts pushing CPU or GPU clocks past stock limits gain the extra thermal headroom this paste provides. System integrators assembling dense server racks benefit from the long-life oil-lock formulation that resists pump-out. Users who only need basic office cooling or who prefer pre-applied pads will find the performance excessive for their needs.
17.5 W/mK thermal conductivity
This single figure determines whether the paste matches the heat load. At 17.5 W/mK it handles extreme dissipation demands from high-wattage CPUs, GPUs and LED modules. If the design target requires lower conductivity, a different grade should be selected.
Besonderheiten
- High thermal conductivity of 17.5 W/mK cuts core temperatures
- Non-conductive formula prevents short circuits on CPU and GPU
- Stable from -50 °C to 250 °C without drying out
- Less than 3 % degradation over five years extends service life
- Smooth silicone texture allows easy, even application
Technische Daten
| Brand | coxbyte |
|---|---|
| Series | TG |
| Model | 30 |
| Volume / Net Weight | 4g |
| Thermal Conductivity | 17.5 W/mK |
| Long Term Operating Temperature | -50 to 250 C |
| Specifications | TG-30 adopts an improved nanocarbon tube composite formula with a thermal conductivity of 17.5W/mK (measured value), which can quickly reduce the temperature difference between CPU/GPU cores and meet the cooling needs of mainstream gaming consoles, high-performance graphics cards, and workstations. Its non-conductive properties completely avoid the risk of short circuit, with good viscosity optimization. Single point or nine point coating can be extended to a uniform thermal conductive layer with a thickness of 0.15mm, improving operational convenience by 15%. After curing, the tempe |
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Fragen zu diesem Artikel
What comes in the package and do I need any extra tools?
The package contains a 4 g syringe of TG-30 thermal paste. A scraper or similar spreading tool is recommended for application and is not included.
How do I decide between the TG-30 and other thermal compounds?
TG-30 delivers 17.5 W/mK thermal conductivity and operates from -50 °C to 250 °C, making it suitable for CPUs, GPUs and LED modules where high heat transfer is required.
What does the 17.5 W/mK rating mean for actual CPU or GPU temperatures?
The manufacturer states the paste can reduce the core-to-cooler temperature difference by over 20 °C under extreme loads.
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