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Grey thermal pad sheet 40 by 30 by 0.2 mm

GELID SOLUTIONS

GELID SOLUTIONS HeatPhase Ultra for Intel 40x30x0.2mm 8.5W/mk thermal pad

SKU CH-GG66-J2R8F

A non-conductive 40x30x0.2mm thermal pad rated at 8.5W/mk that installs cleanly and does not cure or bleed

  • Easier installation and removal saves time
  • 5 W/mK conductivity transfers heat rapidly
  • Non-curing formula keeps performance stable over time
  • Non-electrically conductive material prevents short circuits
  • No-bleed design stays in place for a clean application

Intel-specific thermal pad

The GELID SOLUTIONS HeatPhase Ultra is a pre-cut thermal pad sized 40x30x0.2mm for Intel CPU heat spreaders. It targets builders who want a mess-free alternative to thermal paste during cooler installation. The material delivers 8.5W/mk conductivity and remains non-electrically conductive for safe handling.

Fits standard Intel IHS dimensions

The pad covers the integrated heat spreader without overhang, requiring only a compatible CPU cooler and mounting hardware to complete the assembly. It eliminates the need for syringe application and spreading tools, freeing up bench time and reducing the risk of air bubbles or excess compound near the socket.

Replaces thermal paste on Intel platforms

This pad upgrades from traditional grease when a builder prefers a non-curing, no-bleed interface that maintains consistent thickness over years of thermal cycling. It is not suited for direct-die cooling, GPU memory modules, or any surface that deviates from the specified 40x30mm footprint.

Besonderheiten

  • Easier installation and removal saves time
  • 5 W/mK conductivity transfers heat rapidly
  • Non-curing formula keeps performance stable over time
  • Non-electrically conductive material prevents short circuits
  • No-bleed design stays in place for a clean application

Technische Daten

Für diesen Artikel sind noch keine technischen Daten veröffentlicht.

Fragen zu diesem Artikel

How thick is the 0.2 mm pad after the CPU heats up during long sessions?

The pad stays at 0.2 mm because it does not cure or harden, so its thickness remains stable under sustained load.

Does the pad get hot enough to affect nearby components when the system runs all day?

The 8.5 W/mk conductivity moves heat quickly into the cooler, keeping the pad itself from becoming a heat source during continuous operation.

Which Intel socket and cooler mounting hardware must I already have for this 40 x 30 mm pad to fit?

The pad is cut to 40 x 30 mm for Intel CPUs, so you need a compatible Intel socket and a cooler with matching contact area and mounting pressure.

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