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Two green DDR4 SODIMM modules, 260-pin, no heat spreader

NEMIX RAM

NEMIX RAM MS25600-818K2 16GB 2x8GB DDR4 3200 CL22 1.2V 260-pin SODIMM memory upgrade

SKU CH-6QV9-RRC38

A 16 GB DDR4 SODIMM kit with two 8 GB modules running at 3200 MHz, CL22, 1.2 V, matched for Supermicro X12STN motherboards

  • Capacity16GB (2 x 8GB)
  • Type260-Pin DDR4 SODIMM
  • SpeedDDR4 3200 (PC4 25600)
  • CAS LatencyCL22
  • Voltage1.20V
  • ECCNo

Size 16GB 2X8GB

  • Exact-fit 16 GB kit runs at rated 3200 MHz CL22 on Supermicro X12STN boards
  • 260-pin SODIMM form factor matches the laptop slot, not a desktop UDIMM
  • 2 V operation with 1Rx8 Non-ECC chips keeps power draw low
  • Major OEM Samsung, Micron, Hynix ICs tested for stability at rated speed
  • Lifetime replacement warranty with free US-based technical support included

Precise DDR4 SODIMM kit for Supermicro X12STN

This 16 GB kit contains two 8 GB DDR4 3200 SODIMM modules built to the exact rank, voltage and timing the Supermicro X12STN series expects. The 1Rx8 organisation and CL22 latency let the memory controller recognise full capacity at rated speed without manual tuning. It is a straightforward upgrade for compatible laptops or compact systems using 260-pin slots.

260-pin unbuffered form factor fits laptop slots

Each module uses the 260-pin SODIMM edge connector required by the target platform, not the longer desktop UDIMM layout. Major OEM chips from Samsung, Micron or Hynix are assembled without a heat spreader, keeping the profile low for tight chassis clearance. The 1.2 V operating voltage matches the standard DDR4 SODIMM specification, so no extra power delivery is needed.

DDR4 3200 ceiling limits bandwidth headroom

The PC4-25600 interface tops out at 3200 MT/s, so workloads that scale with memory throughput will hit this ceiling. CL22 latency is fixed by the SPD profile; tighter timings are not supported on this kit. Builders needing higher frequencies, lower latencies or ECC error correction must choose a different memory technology altogether.

Besonderheiten

  • Exact-fit 16 GB kit runs at rated 3200 MHz CL22 on Supermicro X12STN boards
  • 260-pin SODIMM form factor matches the laptop slot, not a desktop UDIMM
  • 2 V operation with 1Rx8 Non-ECC chips keeps power draw low
  • Major OEM Samsung, Micron, Hynix ICs tested for stability at rated speed
  • Lifetime replacement warranty with free US-based technical support included

Technische Daten

BrandNEMIX RAM
SeriesNEMIX RAM Original Series Memory
ModelDDR4 Non-ECC Unbuffered SODIMM Memory
Part NumberMS25600-818K2
Capacity16GB (2 x 8GB)
Type260-Pin DDR4 SODIMM
SpeedDDR4 3200 (PC4 25600)
CAS LatencyCL22
Voltage1.20V
ECCNo
Buffered/RegisteredUnbuffered
Rank1Rx8
ChipsetMajor OEM Samsung, Micron, Hynix
Heat SpreaderNo
Compatible SystemSupermicro
FeaturesDDR4 Non-ECC Unbuffered SODIMM Motherboard Compatible
Package Content16GB 2X8GB DDR4 3200MHz PC4-25600 1Rx8 1.2V 260-PIN Non-ECC SODIMM KIT

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Fragen zu diesem Artikel

What does the DDR4 3200 PC4-25600 interface cap at in practice?

The kit runs at DDR4 3200 (PC4-25600) with CL22 latency and 1.20 V, the exact speed and timing the Supermicro X12STN memory controller expects for full-capacity recognition.

What physical slot and form factor do these modules need to fit?

Each module is a 260-pin DDR4 SODIMM without a heat spreader, matching the laptop-style Unbuffered slot required by the X12STN series boards.

How is the kit installed, and which step do people often get wrong?

Insert both 8 GB sticks into the approved population order shown in the system manual; skipping the manual's slot sequence is the common mistake that prevents full recognition.

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