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White syringe with grey cap and flat plastic spreader

STARTECH

STARTECH High-Performance Silicone Thermal Paste 14.5 W/m·K

SKU CH-HBKZ-6X7Q1

High-performance silicone thermal paste with 14.5 W/m·K conductivity includes spreader for CPU and GPU heat transfer

  • High thermal conductivity of 14.5 W/m·K for efficient heat transfer
  • Silicone-based compound ensures stable performance across temperature ranges
  • Includes plastic spreader for precise and even application
  • Supplied in syringe format for controlled dispensing and storage
  • Improves cooling effectiveness for CPUs, GPUs and other ICs

High-Performance Thermal Paste for CPUs and GPUs

This silicone thermal compound is designed for processors, graphics cards and other integrated circuits. Its 14.5 W/m·K conductivity rating targets enthusiasts and technicians who need reliable heat transfer between a die and a cooler. The product suits both new builds and maintenance on existing systems.

Bundled Spreader and Documentation Aid Application

The package includes a plastic spreader tool that helps create an even layer across the component surface. Printed documentation provides guidance on preparation and technique. These accessories reduce the chance of air gaps and excess paste that can hinder thermal performance.

Simple Syringe Installation with Common Pitfalls

The syringe format allows controlled dispensing directly onto the heat spreader. Installation is straightforward but requires a clean, residue-free surface for optimal results. Applying too much compound or failing to remove old paste are the typical errors that reduce cooling efficiency.

Besonderheiten

  • High thermal conductivity of 14.5 W/m·K for efficient heat transfer
  • Silicone-based compound ensures stable performance across temperature ranges
  • Includes plastic spreader for precise and even application
  • Supplied in syringe format for controlled dispensing and storage
  • Improves cooling effectiveness for CPUs, GPUs and other ICs

Technische Daten

BrandStarTech

Fragen zu diesem Artikel

Will the 14.5 W/m·K silicone compound dry out and need re-application over time?

Silicone-based thermal paste remains stable for years under normal CPU or GPU temperatures and does not require scheduled replacement unless the cooler is removed.

What thermal limit appears first when the paste is under continuous heavy load?

The 14.5 W/m·K conductivity rating defines the maximum steady-state heat flow the compound can sustain before the interface becomes the bottleneck.

Does the cured paste increase fan noise or component temperature during all-day operation?

Once applied the paste adds no moving parts or electrical draw so it generates zero noise and no extra heat beyond conducting the load away from the die.

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