Hyväksymme kryptoa — hallussasi olevat kolikot voivat näin ostaa oikeaa laitteistoa.Maksa kryptolla, käytä se oikeaan laitteistoon. Ilmainen vakuutettu toimitus maailmanlaajuisesti yli 399 $. Neutraalit, tuotemerkittömät ulkopakkaukset, lähetetään Saksasta.Ilmainen vakuutettu toimitus yli 399 $. Kurssisi lukitaan 30 minuutiksi heti, kun kassa avautuu.Kurssi lukittu 30 minuutiksi. Jokainen tuote on sinetöity, sen sarjanumero on tarkistettu, ja sillä on 24 kuukauden takuu.Sinetöity, 24 kuukauden takuu.

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Rectangular E1.L 9.5mm enterprise SSD with green circuit board and black label

Solidigm

Solidigm D5-P5336 30.72TB E1.L 9.5mm PCIe 4.0 enterprise SSD SBFPFWBV307TOF1

SKU CH-TJKW-19S9W MPN SBFPFWBV307TOF1

30.72TB E1.L 9.5mm PCIe 4.0 QLC enterprise SSD with 7000 MBps reads, 3300 MBps writes and FIPS security

  • Form FactorE1.L 9.5mm
  • Capacity30.72TB
  • Memory Components192 L QLC 3D NAND
  • InterfacePCI-Express 4.0
  • Max Sequential ReadUp to 7000 MBps
  • Max Sequential WriteUp to 3300 MBps

Option 30.72TB E1.L FIPS

Näytä 21 muuta kokoonpanoa
  • Massive 30.72TB capacity fits more data per server
  • PCIe 4.0 x4 delivers up to 7000 MBps sequential read speed
  • 192-layer QLC 3D NAND enables high density at lower cost
  • FIPS security protects sensitive data at rest
  • 2,000,000-hour MTBF ensures long-term reliability in data centres

Capacity and form factor

The Solidigm D5-P5336 is a 30.72TB enterprise SSD built in the E1.L 9.5mm form factor. It uses 192 layer QLC 3D NAND and connects through a PCI-Express 4.0 x4 interface. The drive targets data-centre workloads that need high capacity in a slim, hot-pluggable package.

Thermals and power draw

Idle power is 5W and active power reaches 25W during sustained operation. The rated operating temperature range spans 0°C to 70°C. Shock resistance is rated at 1000 G at 0.5 msec and vibration tolerance covers 2.17 GRMS operating and 3.13 GRMS non-operating across the stated frequency bands.

Build integration

The E1.L 9.5mm ruler shape fits dense server chassis that accept this form factor without extra adapters. FIPS certification meets strict security requirements for regulated environments. With 31.5 PBW endurance and a 2,000,000 hour MTBF the drive suits read-heavy deployments, while buyers needing higher random write IOPS or a different physical size should evaluate alternatives.

Kohokohdat

  • Massive 30.72TB capacity fits more data per server
  • PCIe 4.0 x4 delivers up to 7000 MBps sequential read speed
  • 192-layer QLC 3D NAND enables high density at lower cost
  • FIPS security protects sensitive data at rest
  • 2,000,000-hour MTBF ensures long-term reliability in data centres

Tekniset tiedot

BrandSolidigm
ModelD5-P5336
Part NumberSBFPFWBV307TOF1
Form FactorE1.L 9.5mm
Capacity30.72TB
Memory Components192 L QLC 3D NAND
InterfacePCI-Express 4.0
Max Sequential ReadUp to 7000 MBps
Max Sequential WriteUp to 3300 MBps
4KB Random Read1005 KIOPS (4K, QD256)
4KB Random Write43 KIOPS (16K, QD256)
Endurance31.5 PBW (16K RW)
MTBF2,000,000 hours
SecurityFIPS
Power Consumption (Idle)5W
Power Consumption (Active)25W
Operating Temperature0°C ~ +70°C
Max Shock Resistance1,000 G (Max) at 0.5 msec
Max Vibration ResistanceOperating: 2.17 GRMS (5 - 700 Hz) Max
Non-Operating: 3.13 GRMS (5 - 800 Hz) Max
Weight185g +/- 10g
Lähetyspaino0.17 kg
Pakkauksen mitat140 × 110 × 17 mm

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Kysymyksiä tästä tuotteesta

How do I install the E1.L 9.5mm drive in a PCIe 4.0 server slot, and what step is commonly missed?

Insert the drive into the E1.L cage until the latch clicks, then secure the retention screw; the step often missed is tightening that screw, which keeps the PCIe 4.0 x4 link stable under vibration.

What maintenance or replacement will the 192 L QLC 3D NAND need after heavy write cycles?

The drive is rated for 31.5 PBW of 16K random writes; once that endurance budget is consumed the NAND must be replaced, as there are no user-serviceable parts inside.

What limit appears first during sustained 25W active workloads?

The controller throttles write speed once the 70°C operating-temperature ceiling is reached, protecting the 192-layer QLC NAND from thermal stress.

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