UPSIREN
UPSIREN OEM 16W Thermal Pad 100x100x2.0mm 23g
A 100×100×2.0 mm silicone thermal pad rated at 16 W/mK conductivity for CPU, GPU or LED heatsink gaps
- Volume / Net Weight23g
- Thermal Conductivity16W/mk
- Long Term Operating Temperature-40 to 200 C
- FeaturesNon-Corrosive, Non-Curing & Non-Toxi
Option 100 x 100 x 2.0 mm
- 100 x 100 x 3.0 mm
- 100 x 100 x 0.5 mm
- 100 x 100 x 2.0 mm
- 100 x 100 x 1.5 mm
- 100 x 100 x 1.0 mm
- 100*100*2.5mm
- High thermal conductivity at 16 W/mK for efficient heat transfer
- Operates reliably from -40 °C to 200 °C without melting
- Non-conductive silicone insulates components and prevents short circuits
- Soft 30 Shore hardness conforms to uneven surfaces for better contact
- Reusable 100 × 100 × 2.0 mm pad weighs 23 g
16 W/mK thermal pad for compact components
The UPSIREN OEM pad measures 100 by 100 millimetres and is 2.0 millimetres thick. Its 16 W/mK conductivity fills the gap between a small die and a heatsink. The sheet weighs 23 grams and suits laptop GPUs, CPUs, LED modules or similar tight spaces. Builders needing a single reusable interface for low-profile cooling will find it convenient.
Steady heat transfer across a wide range
Rated for continuous operation from minus 40 to 200 Celsius, the silicone does not melt or cure during prolonged loads. The material stays soft at 30 degrees hardness, maintaining contact pressure without hardening over time. Non-corrosive and non-toxic composition protects surrounding metal parts throughout extended use.
Soft compliant sheet simplifies installation
Natural viscosity lets the pad cling during assembly and allows repositioning if required. Electrical insulation prevents short circuits against exposed PCB traces. The 100 millimetre square can be trimmed for smaller chips or used whole for larger spreaders. One piece serves multiple maintenance cycles without degradation.
Kohokohdat
- High thermal conductivity at 16 W/mK for efficient heat transfer
- Operates reliably from -40 °C to 200 °C without melting
- Non-conductive silicone insulates components and prevents short circuits
- Soft 30 Shore hardness conforms to uneven surfaces for better contact
- Reusable 100 × 100 × 2.0 mm pad weighs 23 g
Tekniset tiedot
| Brand | UPSIREN |
|---|---|
| Series | OEM |
| Model | 16W |
| Volume / Net Weight | 23g |
| Thermal Conductivity | 16W/mk |
| Long Term Operating Temperature | -40 to 200 C |
| Features | Non-Corrosive, Non-Curing & Non-Toxi |
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Kysymyksiä tästä tuotteesta
How much heat does the 16 W/mK pad move when a GPU runs all day?
The 16 W/mK conductivity transfers heat continuously across the 2.0 mm thickness, and the silicone stays stable from -40 to 200 °C without curing or drying out.
What surfaces must the builder already have for this 100 x 100 mm pad to seat correctly?
A flat heatsink and chip pair with a gap close to 2.0 mm; the 30-degree shore hardness lets the pad compress and conform without extra adhesive or tools.
Will the non-conductive silicone short legacy boards if it squeezes past the die edge?
The material is electrically insulating and non-corrosive, so overflow onto older PCB traces or solder mask causes no shorts or metal degradation.
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