UPSIREN
UPSIREN OEM Thermal Pad 18W/mK 100x100x1.0mm 23g
High-conductivity silicone pad transfers heat from CPUs, GPUs and LED modules at 18 W/mK while remaining electrically insulating and reusable
- Volume / Net Weight23g
- Thermal Conductivity18W/mk
- Long Term Operating Temperature-40 to 200 C
- FeaturesNon-Corrosive, Non-Curing & Non-Toxi
Option 100 x 100 x 1.0 mm
- 100 x 100 x 3.0 mm
- 100 x 100 x 0.5 mm
- 100 x 100 x 2.0 mm
- 100 x 100 x 1.5 mm
- 100 x 100 x 1.0 mm
- 100*100*2.5mm
- High thermal conductivity of 18 W/mK moves heat efficiently from chip to heatsink
- Soft 30-degree pad compresses to fill gaps and maximise contact area
- Non-conductive silicone insulates electrically for safe use on GPU, CPU and LED modules
- Wide operating range from -40 to 200 °C withstands extreme temperatures without melting
- Reusable 100 × 100 × 1.0 mm pad cuts to size for multiple applications
Purpose and audience
This UPSIREN OEM thermal pad measures 100x100x1.0 mm and weighs 23 g. It is intended for builders and technicians who need a compliant, non-conductive interface between a chip and a heatsink in laptops, GPUs, CPUs or LED coolers. The silicone material compresses to fill uneven gaps without electrical risk. Buyers who need a liquid or paste compound instead of a pre-cut pad should look elsewhere.
Thermal interface limits
The pad is rated at 18 W/mK thermal conductivity, though the description also references a 16 W/mK figure. It remains stable across a long-term operating range of -40 to 200 °C and will not melt within that window. A hardness of 30 degrees allows it to conform to surfaces while maintaining structural integrity. The 1.0 mm thickness defines the maximum gap it can bridge effectively.
Build quality and daily implications
The silicone construction is non-corrosive, non-curing and non-toxic, so it will not degrade metal contacts or become brittle over time. Natural viscosity holds the pad in place during assembly yet permits removal and reuse when components are swapped. Electrical insulation prevents short circuits if the pad bridges adjacent components. The material also resists fire, static, wear and compression fatigue in industrial and consumer environments.
Kohokohdat
- High thermal conductivity of 18 W/mK moves heat efficiently from chip to heatsink
- Soft 30-degree pad compresses to fill gaps and maximise contact area
- Non-conductive silicone insulates electrically for safe use on GPU, CPU and LED modules
- Wide operating range from -40 to 200 °C withstands extreme temperatures without melting
- Reusable 100 × 100 × 1.0 mm pad cuts to size for multiple applications
Tekniset tiedot
| Brand | UPSIREN |
|---|---|
| Series | OEM |
| Model | 18W |
| Volume / Net Weight | 23g |
| Thermal Conductivity | 18W/mk |
| Long Term Operating Temperature | -40 to 200 C |
| Features | Non-Corrosive, Non-Curing & Non-Toxi |
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Kysymyksiä tästä tuotteesta
Should I choose the 1.0 mm pad or a different thickness for my GPU?
This pad is 1.0 mm thick and 100 x 100 mm in size. Measure the gap between your GPU die and heatsink; if it matches 1.0 mm this pad will fit, otherwise select a thickness that matches your measured gap.
What does the 18 W/mK rating deliver in my laptop?
The 18 W/mK conductivity moves heat from the CPU or GPU into the heatsink efficiently, reducing throttling temperatures when the pad is compressed to fill the interface gap.
Is the silicone pad electrically conductive?
No, the pad is non-conductive and insulated, so it will not cause short circuits if it touches exposed components on the board.
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