UPSIREN
UPSIREN OEM 21W Thermal Pad 100x100x1.0mm 23g
A 100×100×1.0 mm silicone pad rated at 21 W/mK thermal conductivity for CPU, GPU or laptop heatsink gaps
- Volume / Net Weight23g
- Thermal Conductivity21W/mk
- Long Term Operating Temperature-40 to 200 C
- FeaturesNon-Corrosive, Non-Curing & Non-Toxi
Option 100 x 100 x 1.0 mm
- 100 x 100 x 3.0 mm
- 100 x 100 x 0.5 mm
- 100 x 100 x 2.0 mm
- 100 x 100 x 1.5 mm
- 100 x 100 x 1.0 mm
- 100*100*2.5mm
- 21 W/mK conductivity moves heat quickly from chip to heatsink
- 0 mm thickness fits standard laptop and desktop gaps
- Non-conductive silicone prevents short circuits on exposed PCB traces
- Soft 30-degree hardness compresses for full surface contact
- Operates reliably from -40 °C to 200 °C
Thermal pad for component gaps
The UPSIREN OEM 21W pad measures 100 by 100 by 1.0 millimetres and weighs 23 grams. It is a silicone thermal interface material rated at 21 watts per metre-kelvin. The pad is non-conductive, non-corrosive, non-curing and non-toxic. It suits laptops, GPUs, CPUs and LED coolers where electrical isolation is required.
Practical limits of the interface
Thermal conductivity is stated as 21 W/mK while the product highlights also reference 16 W/mK. Continuous operating range spans -40 to 200 degrees Celsius without melting. The material fills the air gap between a heat source and a heatsink but cannot replace a mechanical mounting system. It will not conduct electricity, so it prevents shorts if it contacts exposed circuitry.
Build quality and daily implications
Hardness reaches 30 degrees, giving a soft, compressible feel that conforms to uneven surfaces. Natural viscosity holds the pad in place during assembly and allows repositioning or reuse. The pad resists wear, compression set, fire, corrosion and static buildup. It emits no odour and does not degrade metal contact surfaces over time.
Kohokohdat
- 21 W/mK conductivity moves heat quickly from chip to heatsink
- 0 mm thickness fits standard laptop and desktop gaps
- Non-conductive silicone prevents short circuits on exposed PCB traces
- Soft 30-degree hardness compresses for full surface contact
- Operates reliably from -40 °C to 200 °C
Tekniset tiedot
| Brand | UPSIREN |
|---|---|
| Series | OEM |
| Model | 21W |
| Volume / Net Weight | 23g |
| Thermal Conductivity | 21W/mk |
| Long Term Operating Temperature | -40 to 200 C |
| Features | Non-Corrosive, Non-Curing & Non-Toxi |
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Kysymyksiä tästä tuotteesta
Should I pick the 21 W/mK pad or the 16 W/mK pad for my laptop heatsink?
The 21 W/mK pad moves heat faster across the 100 x 100 x 1.0 mm surface, making it the stronger choice for GPU or CPU gaps that run hot.
What does 21 W/mK actually deliver once the pad is compressed between my GPU and heatsink?
At 30 degrees hardness the silicone compresses to fill microscopic voids, letting the 21 W/mK rating translate into lower junction temperatures under load.
Is the pad electrically conductive, and will it short nearby SMD components?
The material is non-conductive and non-corrosive, so it insulates while bridging the gap up to 200 °C without risk of shorts.
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