我們接受加密貨幣付款 — 讓您持有的幣種也能買到真正的硬體設備。以加密貨幣付款，直接購入真正的硬體設備。 全球訂單滿 US$399，即享免費保險運送。簡約外箱，不印任何品牌標誌，從德國出貨。訂單滿 US$399，即享免費保險運送。 結帳一開始，您的匯率即鎖定 30 分鐘。匯率鎖定 30 分鐘。 每件商品皆原廠密封、序號經過核對，並享有 24 個月保固。原廠密封，保固 24 個月。

追蹤清單 登入
Square grey silicone thermal pad 100 by 100 by 1.0 mm, soft matte finish

UPSIREN

UPSIREN OEM 21W Thermal Pad 100x100x1.0mm 23g

SKU CH-ZFY9-PSATM

A 100×100×1.0 mm silicone pad rated at 21 W/mK thermal conductivity for CPU, GPU or laptop heatsink gaps

  • Volume / Net Weight23g
  • Thermal Conductivity21W/mk
  • Long Term Operating Temperature-40 to 200 C
  • FeaturesNon-Corrosive, Non-Curing & Non-Toxi

Option 100 x 100 x 1.0 mm

  • 21 W/mK conductivity moves heat quickly from chip to heatsink
  • 0 mm thickness fits standard laptop and desktop gaps
  • Non-conductive silicone prevents short circuits on exposed PCB traces
  • Soft 30-degree hardness compresses for full surface contact
  • Operates reliably from -40 °C to 200 °C

Thermal pad for component gaps

The UPSIREN OEM 21W pad measures 100 by 100 by 1.0 millimetres and weighs 23 grams. It is a silicone thermal interface material rated at 21 watts per metre-kelvin. The pad is non-conductive, non-corrosive, non-curing and non-toxic. It suits laptops, GPUs, CPUs and LED coolers where electrical isolation is required.

Practical limits of the interface

Thermal conductivity is stated as 21 W/mK while the product highlights also reference 16 W/mK. Continuous operating range spans -40 to 200 degrees Celsius without melting. The material fills the air gap between a heat source and a heatsink but cannot replace a mechanical mounting system. It will not conduct electricity, so it prevents shorts if it contacts exposed circuitry.

Build quality and daily implications

Hardness reaches 30 degrees, giving a soft, compressible feel that conforms to uneven surfaces. Natural viscosity holds the pad in place during assembly and allows repositioning or reuse. The pad resists wear, compression set, fire, corrosion and static buildup. It emits no odour and does not degrade metal contact surfaces over time.

商品特色

  • 21 W/mK conductivity moves heat quickly from chip to heatsink
  • 0 mm thickness fits standard laptop and desktop gaps
  • Non-conductive silicone prevents short circuits on exposed PCB traces
  • Soft 30-degree hardness compresses for full surface contact
  • Operates reliably from -40 °C to 200 °C

商品規格

BrandUPSIREN
SeriesOEM
Model21W
Volume / Net Weight23g
Thermal Conductivity21W/mk
Long Term Operating Temperature-40 to 200 C
FeaturesNon-Corrosive, Non-Curing & Non-Toxi

其他版本

同系列還有 5 款

同系列產品，記憶體、散熱器或時脈不同 — 下單前請先比較。

商品問答

Should I pick the 21 W/mK pad or the 16 W/mK pad for my laptop heatsink?

The 21 W/mK pad moves heat faster across the 100 x 100 x 1.0 mm surface, making it the stronger choice for GPU or CPU gaps that run hot.

What does 21 W/mK actually deliver once the pad is compressed between my GPU and heatsink?

At 30 degrees hardness the silicone compresses to fill microscopic voids, letting the 21 W/mK rating translate into lower junction temperatures under load.

Is the pad electrically conductive, and will it short nearby SMD components?

The material is non-conductive and non-corrosive, so it insulates while bridging the gap up to 200 °C without risk of shorts.

同類商品

顧客也比較過

同一分類，同一套結帳流程 — 支援八種加密貨幣，匯率鎖定 30 分鐘。