ASUS TUF Gaming B650M-E + Ryzen 5 9600X AMD motherboard & CPU combo
- AM5
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ASUS
An AMD AM5 motherboard and Ryzen 7 9700X CPU combo with 14+2+1 80A DrMOS power stages, DDR5 support up to 192GB, PCIe 5.0 x16 and M.2 slots, Wi-Fi 7, Bluetooth 5.4 and 2.5Gb LAN
Motherboard PRIME X870-P WIFI
CPU + R7 9700X
This bundle pairs an ASUS PRIME X870-P WIFI motherboard with a Ryzen 7 9700X processor. The board uses the AMD X870 chipset and AM5 socket to support Ryzen 9000, 8000 and 7000 series CPUs. Four DDR5 slots accept up to 192 GB of memory running at 4400 MT/s with EXPO profiles. It suits enthusiasts who want a ready-to-run platform for AI workloads and high-frame-rate gaming.
The 14+2+1 80 A DrMOS power stages sit under a large VRM heatsink backed by an 8-layer PCB and ProCool connectors. Dual M.2 heatsinks and a PCH heatsink handle storage and chipset heat. Hybrid fan headers work with Fan Xpert 4 and AI Cooling II to balance airflow and noise under load. Realtek 7.1 audio with shielding keeps the signal clean.
PCIe Slot Q-Release lets you remove a graphics card with one hand. M.2 Q-Latch secures 2280 drives without screws. A pre-mounted I/O shield, Q-Antenna for Wi-Fi 7 and Bluetooth 5.4, BIOS FlashBack and Q-LED Core diagnostics simplify the build. USB4 40 Gbps Type-C, front and rear 10 Gbps USB plus 2.5 Gb LAN complete the I/O.
| Brand | ASUS |
|---|---|
| Model | PRIME X870-P WIFI+R7 9700X |
| Chipset | AMD X870 |
| Number of Memory Slots | 4x288pin (DDR5) |
| Memory Standard | DDR5 4400 |
| Maximum Memory Supported | 192GB |
| Channel Supported | Dual Channel |
| ECC Supported | Yes |
| Buffer Supported | Un-buffered |
| Memory Feature | Supports up to 8000+MT/s(OC) with Ryzen 9000 & 8000 & 7000 Series Processors ECC and Non-ECC, Un-buffered DIMM* Dual channel memory architecture Supports AMD Extended Profiles for Overclocking (EXPO) ASUS Enhanced Memory Profile (AEMP) * Non-ECC, un-buffered DDR5 memory supports On-Die ECC function. |
| PCI Express 5.0 x16 | AMD Ryzen 9000 & 7000 Series Desktop Processors 1 x PCIe 5.0 x16 slot (supports x16 mode) |
| PCI Express 4.0 x16 | AMD Ryzen 8000 Series Desktop Processors 1 x PCIe 4.0 x16 slot (supports x8/x4 mode) AMD X870 Chipset 3 x PCIe 4.0 x16 slots (support x1 mode)*** *** PCIEX16(G4)_1 shares bandwidth with M.2_2. PCIEX16(G4)_1 will be disabled when M.2_2 runs. *** PCIEX16(G4)_2 and PCIEX16(G4)_3 share bandwidth with M.2_3. PCIEX16(G4)_2 and PCIEX16(G4)_3 will be disabled when M.2_3 runs. |
| Serial ATA (SATA) | 2 x SATA 6Gb/s |
| M.2 | AMD Ryzen 9000 & 7000 Series Desktop Processors M.2_1 slot (Key M), type 2280 (supports PCIe 5.0 x4 mode) AMD Ryzen 8000 Series Desktop Processors M.2_1 slot (Key M), type 2280 (supports PCIe 4.0 x4 mode) AMD X870 Chipset M.2_2 slot (Key M), type 2242/2260/2280 (supports PCIe 4.0 x4 mode)** M.2_3 slot (Key M), type 2280 (supports PCIe 4.0 x4 mode)*** M.2_4 slot (Key M), type 2280 (supports PCIe 3.0 x2 mode)**** ** PCIEX16(G4)_1 shares bandwidth with M.2_2. PCIEX16(G4)_1 will be disabled when M.2_2 runs. *** PCIEX16(G4)_2 and PCIEX16(G4)_3 share bandwidth with M.2_3. PCIEX16(G4)_2 and |
| SATA RAID | * AMD RAIDXpert2 Technology supports both PCIe RAID 0/1/5/10 and SATA RAID 0/1. RAID 5 Function is only supportted by AMD Ryzen 9000 series CPU. |
| Audio Chipset | Realtek 7.1 Surround Sound High Definition Audio CODEC* - Supports: Jack-detection, Multi-streaming, Front Panel Jack-retasking - Supports up to 24-Bit/192 kHz playback Audio Features - Audio Shielding - Premium audio capacitors - Dedicated audio PCB layers * A chassis with an HD audio module in the front panel is required to support 7.1 Surround Sound audio output. |
| Audio Channels | 7.1 Channels |
| Max LAN Speed | 2.5Gbps |
| Wireless LAN | Wi-Fi 802.11 be |
| Bluetooth | Bluetooth 5.4 |
| Back I/O Ports | 2 x USB4 (40Gbps) ports (2 x USB Type-C) 1 x USB 10Gbps port (1 x Type-A) 3 x USB 5Gbps ports (3 x Type-A) 4 x USB 2.0 ports (4 x Type-A) 1 x HDMI port 1 x Wi-Fi module 1 x Realtek 2.5Gb Ethernet port 3 x Audio jacks 1 x BIOS FlashBack button |
| Onboard USB | 1 x USB 10Gbps connector (supports USB Type-C) 1 x USB 5Gbps header supports 2 additional USB 5Gbps ports 2 x USB 2.0 headers support 4 additional USB 2.0 ports |
| Other Connectors | Fan and Cooling Related 1 x 4-pin CPU Fan header 1 x 4-pin CPU OPT Fan header 1 x 4-pin AIO Pump header 4 x 4-pin Chassis Fan headers Miscellaneous 3 x Addressable Gen2 headers 1 x Clear CMOS header 1 x COM Port header 1 x Front Panel Audio header (F_AUDIO) 1 x S/PDIF Out header 1 x SPI TPM header (14-1 pin) 1 x 10-1 pin System Panel header |
| Form Factor | ATX |
| Dimensions (W x L) | 12.0" x 9.6" |
| Power Pin | 1 x 24-pin Main Power connector 2 x 8-pin +12V CPU Power connectors |
| BIOS Feature | 256 Mb Flash ROM, UEFI AMI BIOS |
| Windows 11 | Supported |
| Features | ASUS 5X PROTECTION III - DIGI+ VRM (- Digital power design with DrMOS) - LANGuard - Overvoltage protection - SafeSlot - Stainless-steel back I/O ASUS Q-Design - M.2 Q-Latch - PCIe Slot Q-Release - Q-Antenna - Q-Dashboard - Q-DIMM - Q-LED Core - Q-Slot ASUS Thermal Solution - Flexible M.2 heatsink - VRM heatsink design ASUS EZ DIY - BIOS FlashBack button - BIOS FlashBack LED - ProCool - Pre-mounted I/O shield - SafeSlot Aura Sync - Addressable Gen2 headers |
| Package Contents | 1 x AMD Ryzen 7 9700X CPU 1 x Shin-Etsu X-23-7868-2D (1.8g) Cables 2 x SATA 6Gb/s cables Miscellaneous 1 x ASUS WiFi Q-Antenna 1 x M.2 rubber package 2 x Screw packages for M.2 SSD Documentation 1 x Quick start guide |
Autres versions de ce modèle
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Lift the retention lever, align the gold triangle on the Ryzen 7 9700X with the socket marker, lower the chip without pressure, then close and lock the lever; the step often missed is removing the plastic protective cover from the socket before seating the processor.
Dust the large VRM heatsink and dual M.2 heatsinks with compressed air every few months; the 14+2+1 80A DrMOS power stages run cooler when fins stay clear, and the pre-mounted I/O shield does not require removal for cleaning.
The 5.5 GHz max boost clock drops to the all-core frequency once the 14+2+1 80A DrMOS stages hit their thermal ceiling, so VRM temperature under the large heatsink becomes the first bottleneck during prolonged heavy loads.
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