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Silver 1U rack server front panel with four 2.5 inch drive bays

DELL

DELL PowerEdge XR5610 1U rack server Xeon Scalable DDR5 8 DIMM slots 4×2.5″ bays

SKU CH-YVFJ-3AC8B MPN PowerEdge_XR5610

A 1U rack server for vRAN and edge workloads, supporting one Xeon Scalable CPU, eight DDR5 DIMM slots up to 1 TB, and four 2.5″ SAS/SATA/NVMe bays with two PCIe 5.0 and one OCP 3.0 slots

  • WorkloadvRAN, ORAN, Centralized RAN, Distributed RAN, Network Edge,
  • TypeRack
  • Rack Height1U
  • SecurityCryptographically signed firmware Data at Rest Encryption (S
  • CPU TypeIntel Xeon Scalable
  • # of Processors Installed0
  • depth 1U rack form factor fits space-constrained edge sites
  • Single Intel Xeon Scalable processor socket for telco workloads
  • Eight DDR5 DIMM slots support up to 1 TB registered ECC memory
  • Four 2.5″ bays accept SAS, SATA or NVMe solid-state drives
  • Two full-height PCIe 5.0 plus one OCP 3.0 slot for accelerators

Purpose-built edge server

The DELL PowerEdge XR5610 is a 1U rack system designed for vRAN, ORAN, centralized RAN, distributed RAN, network edge, retail, military and defense workloads. It accepts a single Intel Xeon Scalable processor and up to eight registered ECC DDR5 DIMMs running at speeds up to 5600 MT/s. Four 2.5-inch bays support SAS, SATA or NVMe solid-state drives for local storage.

Thermal and power profile

The short-depth 1U chassis measures 1.68 inches high, 19 inches wide and 19.2 inches deep with a weight of 24.84 units, allowing deployment in space-constrained edge cabinets. Cooling is engineered for continuous operation in rugged environments while maintaining acoustic levels suitable for non-datacenter locations. Power draw scales with the chosen processor, memory population and accelerator cards installed in the available slots.

Build integration

Two full-height half-length PCIe 5.0 slots and one OCP 3.0 slot provide acceleration and networking expansion without consuming drive bays. The platform includes cryptographically signed firmware, secure boot, secured component verification, secure erase, silicon root of trust and TPM 2.0 with FIPS and CC-TCG certification for hardware integrity. No operating system, processor or memory modules are included, so the builder selects components matched to the specific workload.

Points forts

  • depth 1U rack form factor fits space-constrained edge sites
  • Single Intel Xeon Scalable processor socket for telco workloads
  • Eight DDR5 DIMM slots support up to 1 TB registered ECC memory
  • Four 2.5″ bays accept SAS, SATA or NVMe solid-state drives
  • Two full-height PCIe 5.0 plus one OCP 3.0 slot for accelerators

Caractéristiques

BrandDELL
SeriesPowerEdge XR5610
WorkloadvRAN, ORAN, Centralized RAN, Distributed RAN, Network Edge, Retail, Military & Defense
TypeRack
Rack Height1U
SecurityCryptographically signed firmware
Data at Rest Encryption (SEDs with local or external key mgmt)
Secure Boot
Secured Component Verification (Hardware integrity check)
Secure Erase
Silicon Root of Trust
System Lockdown (requires iDRAC9 Enterprise or Datacenter)
TPM 2.0 FIPS, CC-TCG certified, TPM 2.0 China NationZ
CPU TypeIntel Xeon Scalable
# of Processors Installed0
MAX Processors1
Installed Memory SizeNo
Memory TypeDDR5
Max Memory Capacity1TB
Memory FeaturesSpeeds up to 5600 MT/s. Supports registered ECC DDR5 DIMMs only
Number of Memory Slots8
Hard Drive (Installed)None
HDD InterfaceSATA/SAS
SSD (Installed)No
GPU Type2 x FHHL PCIe 5.0 and 1 x OCP 3.0
Expansion Bays4 x 2.5” SAS/SATA/NVMe SSD
Operating SystemNo
Dimensions1.68" x 19" x 19.2"
Weight24.84 lbs.
Poids d’expédition18.14 kg
Dimensions du colis889 × 635 × 127 mm

Questions sur cet article

How do I install the Intel Xeon Scalable processor in this 1U rack server, and which step is most often missed?

Seat the single supported CPU into the LGA socket, apply thermal paste evenly, then torque the heatsink retention screws in a cross pattern; the step most installers skip is updating the iDRAC9 firmware before first boot so the Silicon Root of Trust verifies the new processor.

What maintenance or replacement will the DDR5 memory subsystem need over time?

The eight registered ECC DDR5 slots run at up to 5600 MT/s; plan to replace any DIMM that logs correctable error thresholds in the iDRAC9 event log, and reseat modules during scheduled dust cleaning to maintain contact integrity.

Which limit appears first when the four 2.5″ SAS/SATA/NVMe bays run sustained write workloads?

The backplane’s shared PCIe 5.0 lanes feeding the bays and the two FHHL accelerator slots saturate before the drive media, so sustained throughput caps at the aggregate lane bandwidth rather than individual SSD specs.

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