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White 360 mm AIO with three 120 mm ARGB fans and illuminated pump block

Geometric Future

Geometric Future Eskimo Plus 36 360mm liquid cooler White

SKU CH-FAQY-800WD

A 360 mm all-in-one CPU cooler with three 30 mm-thick PWM ARGB fans, a 1.5 L/min ceramic-bearing pump, and a copper cold plate for Intel and AMD sockets

  • TypeLiquid Cooling System
  • Block MaterialCopper
  • Pump BearingCeramic
  • Pump Noise24.3 dBA
  • Radiator Size397 mm
  • Radiator MaterialAluminum

Model Eskimo Plus 360

  • Eskimo Pro 420
  • Eskimo Plus 360
  • Eskimo Pro 360

Les versions barrées existent, mais ne sont pas disponibles ici.

Fan Size 3 Fan Slots / 120x30mm

  • 3 Fan Slots / 140x25mm
  • 3 Fan Slots / 120x30mm
  • 3 Fan Slots / 120x25mm

Les versions barrées existent, mais ne sont pas disponibles ici.

Color White

  • High-flow pump moves 1.5 L/min at 2600 RPM for rapid CPU heat transfer
  • Three 30 mm thick Squama 3003 fans deliver 84 CFM airflow and 2.93 mmH₂O pressure
  • 360 mm aluminium radiator with 397 mm length provides large surface for efficient cooling
  • ARGB lighting on pump block and fans syncs with motherboard software for unified aesthetics
  • Supports Intel LGA 1851/1700/1200/115X/2011/2066 and AMD AM5/AM4 sockets with 450 mm braided tubing

360 mm AIO for high-performance CPUs

The Geometric Future Eskimo Plus 36 is a 360 mm all-in-one liquid cooler designed for modern Intel and AMD processors. It fits Intel LGA 1851, 1700, 1200, 115X, 2011 and 2066 sockets as well as AMD AM5 and AM4 platforms. The white finish and ARGB lighting on the pump block and three Squama 3003 fans suit showcase builds.

Sustained load with high-flow pump and thick fans

A three-phase nine-pole pump runs at 2600 RPM and moves up to 1.5 L/min of coolant through the 397 mm aluminium radiator. Three 120 x 120 x 30 mm PWM fans spin between 800 and 2300 RPM, delivering 84 CFM airflow and 2.93 mmH₂O static pressure to maintain radiator performance during extended workloads.

Thermals, noise and power in normal use

The pump produces 24.3 dBA while the fans reach 35.8 dBA at maximum speed. The 450 mm nylon-braided tubes allow flexible routing inside a variety of cases. A copper cold plate and low-volatility polymer thermal paste are included to ensure consistent thermal transfer under typical operating conditions.

Points forts

  • High-flow pump moves 1.5 L/min at 2600 RPM for rapid CPU heat transfer
  • Three 30 mm thick Squama 3003 fans deliver 84 CFM airflow and 2.93 mmH₂O pressure
  • 360 mm aluminium radiator with 397 mm length provides large surface for efficient cooling
  • ARGB lighting on pump block and fans syncs with motherboard software for unified aesthetics
  • Supports Intel LGA 1851/1700/1200/115X/2011/2066 and AMD AM5/AM4 sockets with 450 mm braided tubing

Caractéristiques

BrandGeometric Future
SeriesEskimo Plus
ModelEskimo Plus 36
TypeLiquid Cooling System
Block MaterialCopper
Pump BearingCeramic
Pump Noise24.3 dBA
Radiator Size397 mm
Radiator MaterialAluminum
Fan Size3 Fan Slots (120 mm)
Fan Dim.120 x 120 x 30
Fan RPM800~2300
Fan Air Flow84
Fan Noise35.8
Fan Connector4 Pin
ColorWhite
Pressure2.93

Autres versions de ce modèle

1 de plus dans cette gamme

Même famille, mémoire, ventirad ou fréquence différents — comparez avant de vous décider.

Questions sur cet article

How loud is the 30 mm thick Squama 3003 fan at full 2300 RPM when the cooler runs all day?

The three Squama 3003 fans produce 35.8 dBA at maximum speed while the pump adds 24.3 dBA, so the combined noise stays low even under continuous load.

Which motherboard headers and sockets must my system already have to install this 360 mm AIO?

You need a 4-pin PWM header for each of the three fans, an ARGB header for lighting sync, and a CPU socket from Intel LGA 1851, 1700, 1200, 115X, 2011, 2066 or AMD AM5, AM4.

Will the 397 mm radiator and 450 mm tubes fit alongside an older full-size ATX motherboard and tall RAM in my existing case?

The 397 mm radiator occupies three 120 mm fan slots, and the 450 mm nylon-braided tubes give enough reach to route around large heatsinks or high-profile memory modules.

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