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GIGABYTE

GIGABYTE B760M GAMING PLUS WIFI DDR4 LGA 1700 Intel motherboard

SKU CH-2EXA-M3GT3

Micro-ATX Intel B760 board for 12th, 13th and 14th Gen CPUs with DDR4, dual PCIe 4.0 M.2 slots, front USB 3.2 Gen 1 Type-C, Wi-Fi 6 and 1 GbE LAN

  • CPU Socket TypeLGA 1700
  • ChipsetIntel B760
  • Number of Memory Slots4x288pin (DDR4)
  • Memory StandardDDR4 3200
  • Maximum Memory Supported128GB
  • Channel SupportedDual Channel
  • Supports 14th, 13th and 12th Gen Intel processors via LGA 1700 socket
  • Four DDR4 DIMM slots deliver dual-channel memory up to 128 GB capacity
  • Hybrid 4+1+1 phase digital VRM provides stable power delivery for demanding workloads
  • Two PCIe 4.0 M.2 slots plus front USB 3.2 Gen 1 Type-C header enable fast storage and peripherals
  • Integrated 1 GbE LAN, Wi-Fi 6 and Bluetooth 5.3 give versatile networking options

B760M Gaming Plus DDR4 for LGA 1700 builds

This GIGABYTE motherboard pairs Intel 12th 13th and 14th Gen processors with DDR4 memory on a compact M-ATX layout. Four 288pin slots support dual channel operation up to 128GB capacity. The board targets builders who want modern CPU compatibility without replacing existing DDR4 kits.

Hybrid VRM and Smart Fan 6 keep thermals in check

A 4+1+1 phase digital VRM delivers stable power to the CPU while Smart Fan 6 adjusts fan curves based on system temperatures. The design runs quietly during everyday workloads and maintains headroom for sustained loads. No liquid cooling or oversized heatsinks are required for normal operation.

Two PCIe 4.0 M.2 slots

Both M.2 sockets accept 2280 drives at PCIe 4.0 x4 speeds freeing up the four SATA 6Gbps ports for bulk storage. A front panel USB 3.2 Gen 1 Type C header connects modern cases directly. WiFi 6 and Bluetooth 5.3 plus 1Gbps LAN handle networking without add in cards. Q-Flash Plus updates BIOS without a CPU installed.

Points forts

  • Supports 14th, 13th and 12th Gen Intel processors via LGA 1700 socket
  • Four DDR4 DIMM slots deliver dual-channel memory up to 128 GB capacity
  • Hybrid 4+1+1 phase digital VRM provides stable power delivery for demanding workloads
  • Two PCIe 4.0 M.2 slots plus front USB 3.2 Gen 1 Type-C header enable fast storage and peripherals
  • Integrated 1 GbE LAN, Wi-Fi 6 and Bluetooth 5.3 give versatile networking options

Caractéristiques

BrandGIGABYTE
ModelB760M GAMING PLUS WIFI DDR4
CPU Socket TypeLGA 1700
ChipsetIntel B760
Number of Memory Slots4x288pin (DDR4)
Memory StandardDDR4 3200
Maximum Memory Supported128GB
Channel SupportedDual Channel
Memory FeatureSupport for DDR4 5333(O.C.)/ 5133(O.C.)/ 5000(O.C.)/ 4933(O.C.)/ 4800(O.C.)/ 4700(O.C.)/ 4600(O.C.)/ 4500(O.C.)/ 4400(O.C.)/ 4300(O.C.)/ 4266(O.C.)/ 4133(O.C.)/ 4000(O.C.)/ 3866(O.C.)/ 3800(O.C.)/ 3733(O.C.)/ 3666(O.C.)/ 3600(O.C.)/ 3466(O.C.)/ 3400(O.C.)/ 3333(O.C.)/ 3300(O.C.)/3200/3000/2933/2666/2400/2133 MT/s memory modules
4 x DDR4 DIMM sockets supporting up to 128 GB (32 GB single DIMM capacity) of system memory
Dual channel memory architecture
Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules (operate in non-ECC mode)
Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx1
PCI Express 4.0 x161 x PCI Express x16 slot, supporting PCIe 4.0 and running at x16
PCI Express x12 x PCI Express x1 slots, supporting PCIe 3.0 and running at x1
Serial ATA (SATA)4 x SATA 6Gb/s
M.21 x M.2 connector (Socket 3, M key, type 2280 PCIe 4.0 x4/x2 SSD support) (M2A_CPU)
1 x M.2 connector (Socket 3, M key, type 2280 PCIe 4.0 x4/x2 SSD support) (M2P_SB)
SATA RAIDRAID 0, RAID 1, RAID 5, and RAID 10 support for SATA storage devices
Audio Channels7.1 Channels
Max LAN Speed1Gbps
Wireless LANWi-Fi 802.11 ax
BluetoothBLUETOOTH 5.3
Back I/O Ports2 x USB 2.0/1.1 ports
1 x PS/2 keyboard/mouse port
2 x SMA antenna connectors (2T2R)
1 x DisplayPort
1 x HDMI port
3 x USB 3.2 Gen 1 ports
1 x RJ-45 port
3 x audio jacks
Onboard USB1 x USB Type-C header, with USB 3.2 Gen 1 support
1 x USB 3.2 Gen 1 header
2 x USB 2.0/1.1 headers
Other Connectors1 x CPU fan header
3 x system fan headers
1 x addressable LED strip header
1 x RGB LED strip header
1 x front panel header
1 x front panel audio header
1 x Trusted Platform Module header (For the GC-TPM2.0 SPI/GC-TPM2.0 SPI 2.0 / GC-TPM2.0 SPI V2 module only)
1 x serial port header
1 x parallel port header
1 x S/PDIF Out header
1 x Q-Flash Plus button
1 x reset jumper
1 x Clear CMOS jumper
Windows 11Supported
Form FactorMicro ATX
Dimensions (W x L)9.6" x 9.6"
Power Pin1 x 24-pin ATX main power connector
1 x 8-pin ATX 12V power connector
FeaturesSupport for GIGABYTE Control Center (GCC)
Support for Q-Flash
Support for Q-Flash Plus
H/W Monitoring:
Voltage detection
Temperature detection
Fan speed detection
Water cooling flow rate detection
Fan fail warning
Fan speed control

Questions sur cet article

How do I install the CPU into the LGA 1700 socket without bending pins?

Lift the retention lever, align the processor notches with the socket keys, lower the CPU gently without pressure, close the frame, and lock the lever back down — the step people miss is skipping the visual notch check before seating.

What maintenance will the M.2 SSD slots need over time?

The two PCIe 4.0 x4 M.2 connectors have no moving parts; just keep the motherboard free of dust so the thermal pads on the heatsinks can transfer heat from installed 2280 drives.

Which limit appears first when the VRM runs under sustained load?

The hybrid 4+1+1 phase digital VRM will hit its thermal ceiling before the 8+4 pin CPU power connectors reach their current rating, so case airflow and Smart Fan 6 curves determine how long full boost holds.

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