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Black 17.3 inch ThinkPad P71 mobile workstation with fingerprint reader

Lenovo

Lenovo ThinkPad P71 17.3" Xeon E3-1505M 64GB ECC 2TB SSD Quadro P3000 4G LTE

SKU CH-3TAX-5KYZW

17.3-inch mobile workstation with Xeon E3-1505M v6, 64GB ECC DDR4, 2TB SSD and Quadro P3000 graphics

  • ColorBlack
  • Other FeaturesFingerprint reader, Secure Chip
  • Operating SystemWindows 10 Pro
  • CPU TypeIntel Xeon
  • Processor NameIntel Xeon E3-1505M v6
  • Core NameKaby Lake
  • Intel Xeon E3-1505M v6 processor reaches 4.00 GHz turbo frequency
  • 3 inch FHD IPS display delivers 1920 x 1080 resolution
  • NVIDIA Quadro P3000 graphics with 6GB VRAM drives professional visual workloads
  • 64GB DDR4 ECC memory at 2400 MHz protects data integrity
  • 2TB SSD and 4G LTE WWAN provide high-capacity storage and mobile connectivity

Mobile workstation with Xeon E3-1505M v6

The Lenovo ThinkPad P71 is a 17.3-inch mobile workstation built for professionals who need ISV-certified stability. It combines a quad-core Xeon processor with 64GB of DDR4 ECC memory and a 2TB SSD. The NVIDIA Quadro P3000 GPU provides 6GB of VRAM for 3D rendering and CAD workflows. 4G LTE WWAN keeps you connected away from Wi-Fi.

Upgrade from consumer laptops lacking ECC

Moving to this platform is worth it when your workload demands error-correcting memory for data integrity or certified drivers for professional applications. The Xeon CPU reaches a 4.0 GHz turbo frequency for heavy multitasking. The 1920 x 1080 IPS anti-glare display offers accurate colour for visual work. Windows 10 Pro supports domain join and BitLocker encryption.

Verify your software runs on Windows 10 Pro

Ensure your critical applications are compatible with Windows 10 Pro before deploying this unit. The non-touch FHD screen suits traditional desktop workflows but not pen input. A fingerprint reader and secure chip provide hardware-based authentication. Consider whether the 17.3-inch chassis meets your portability requirements for mobile use.

Points forts

  • Intel Xeon E3-1505M v6 processor reaches 4.00 GHz turbo frequency
  • 3 inch FHD IPS display delivers 1920 x 1080 resolution
  • NVIDIA Quadro P3000 graphics with 6GB VRAM drives professional visual workloads
  • 64GB DDR4 ECC memory at 2400 MHz protects data integrity
  • 2TB SSD and 4G LTE WWAN provide high-capacity storage and mobile connectivity

Caractéristiques

BrandLenovo
SeriesP71
ModelThinkpad
Part Number20HK
ColorBlack
Other FeaturesFingerprint reader, Secure Chip
Operating SystemWindows 10 Pro
CPU TypeIntel Xeon
Processor NameIntel Xeon E3-1505M v6
Core NameKaby Lake
Turbo Frequency4.00 GHz
Number of CoresQuad-core Processor
CPU L2 Cache8 MB
CPU L3 Cache8 MB
Screen Size17.3"
TouchscreenNon-Touch Screen
Display TypeFHD
Resolution1920 x 1080
Display FeaturesIn-plane Switching (IPS) Technology
GPU/VPUNVIDIA Quadro P3000
Video MemoryDedicated 6 GB
Graphic TypeDedicated Card
SSD2TB
HDDNo
Memory64GB
Memory SpeedDDR4 2400
LAN10/100/1000Mbps
WLAN802.11ac Wireless LAN
BluetoothBluetooth 4.1
USB4
Video Port2 x Thunderbolts
Docking Connector1
Audio Ports1 x Headphone/Microphone Combo Jack
AudioIntegrated Sound card
SpeakerIntegrated Stereo Speakers
TouchpadThinkPad UltraNav
KeyboardFull size with Keyboard light
Backlit KeyboardBacklit
Other Input DevicesYes
WebcamYes
Card Reader4-in-1
StyleStandard
TypeWorkstation
UsageBusiness
AC Adapter/Charger230-watt AC Adapter
Battery8-cell Lithium Ion
Dimensions (W x D x H)16.38 x 10.85 x 1.3
Weight7 - 7.9 lbs.

Questions sur cet article

Does the 17.3" chassis accept standard 2.5" drive caddies for the 2TB SSD?

The 2TB SSD is already installed inside the 17.3" workstation; no additional caddy is required for the supplied drive.

Which screw type secures the bottom cover when upgrading the 64GB DDR4 ECC memory?

The bottom cover uses standard Phillips-head screws; remove them, then press the SO-DIMM modules firmly into the slots until the retention clips click.

Is the 64GB DDR4 ECC memory user-replaceable if a module fails later?

Yes, the four SO-DIMM slots are accessible under the bottom cover, allowing individual module replacement without soldering.

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