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Grey rectangular silicone thermal pad 85 by 45 by 3.0 mm weighing 15 g

Lirealar

Lirealar 85x45mm 12.8 W/mK thermal pad 3.0mm 15g

SKU CH-507B-SV5DK MPN 85x45mm

A 12.8 W/mK silicone pad measuring 85 x 45 x 3.0 mm that fills gaps between chips and heatsinks while remaining electrically non-conductive

  • Volume / Net Weight15g
  • Thermal Conductivity12.8 W/mK,
  • Long Term Operating Temperature-40 C to +400C
  • SpecificationsColor:Gray Thermal Conductivity:12.8W/M-K Density:3.1±0.2g/c
  • FeaturesNon-Elecnical Conducive Non-Corrosive, Non-Curing & Non-Toxi

Type Thermal Pad

Model 85x45mm

Les versions barrées existent, mais ne sont pas disponibles ici.

Specification 3.0mm

Voir les 1 autres configurations
  • High 12.8 W/mK conductivity moves heat quickly
  • 0 mm thickness bridges uneven surfaces effectively
  • Non-conductive silicone insulates sensitive components safely
  • Operates from -40 °C to 200 °C without degradation
  • Reusable natural viscosity simplifies installation and maintenance

Ideal for laptops and compact GPUs

This 85x45mm thermal pad targets builders servicing laptops, small-form-factor graphics cards or LED coolers where a thin, pre-cut interface is required. The 3.0mm thickness suits tight tolerances between dies and heatsinks in confined assemblies. Its 12.8 W/mK conductivity handles concentrated heat loads from mobile CPUs and GPU memory modules. The 15g single pad covers one typical notebook chipset or memory array.

Non-conductive silicone, reusable fit

Gray silicone construction carries a 3.1±0.2g/cc density and 30-55 Shore C hardness, letting it conform to uneven surfaces without flowing or curing over time. Breakdown voltage exceeds 9.8KV at 1mm, so the pad remains electrically insulating across GPU VRAM, CPU packages and power circuitry. Natural viscosity holds position during assembly yet allows clean removal for rework. The material resists corrosion and is rated non-toxic for consumer hardware environments.

Replaces stock pads or paste in thin gaps

Upgrade from factory-fitted 1-2mm pads or dried paste when the original interface has compressed, pumped out or cracked after thermal cycles. The 3.0mm profile bridges larger stack-up variances found in aftermarket heatsink swaps or shimmed memory cooling. The jump is worth it when temperatures remain high despite proper mounting pressure and the gap exceeds what thin paste layers can reliably fill. Not suited for applications needing sub-1mm bond lines or liquid-metal performance.

Points forts

  • High 12.8 W/mK conductivity moves heat quickly
  • 0 mm thickness bridges uneven surfaces effectively
  • Non-conductive silicone insulates sensitive components safely
  • Operates from -40 °C to 200 °C without degradation
  • Reusable natural viscosity simplifies installation and maintenance

Caractéristiques

SeriesThermal Pad
Model85x45x3mm
Volume / Net Weight15g
Thermal Conductivity12.8 W/mK,
Long Term Operating Temperature-40 C to +400C
SpecificationsColor:Gray Thermal Conductivity:12.8W/M-K Density:3.1±0.2g/cc Hardness:30-55(Sc) Breakdown Voltage:>9.8KV(1mm) Temperature Range:-40°C~200°C
FeaturesNon-Elecnical Conducive Non-Corrosive, Non-Curing & Non-Toxi One Pad , multi-purpose, durable,insulated, non-conductive lnsulation does not conduct electricity and is safe for use Natural viscosity, easy to assemble and reusable

Autres versions de ce modèle

5 de plus dans cette gamme

Même famille, mémoire, ventirad ou fréquence différents — comparez avant de vous décider.

Questions sur cet article

What thermal conductivity does the 12.8 W/mK rating deliver in practice?

The pad conducts heat at 12.8 W/mK, filling gaps between a component and its heatsink to lower contact resistance and improve cooling.

What clearance and surface area does the 85 x 45 x 3.0 mm pad need to fit?

The pad measures 85 mm by 45 mm with a 3.0 mm thickness and weighs 15 g, so it requires a mating surface at least that large and a 3 mm gap.

How is the pad installed, and what step do users often miss?

Remove both protective films, place the grey pad on the clean component, then press the heatsink down evenly; the natural viscosity holds it without adhesive.

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