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NEMIX RAM

NEMIX RAM 16GB (2x8GB) DDR4 3200 ECC UDIMM server RAM

SKU CH-WX2R-MGDN8

16 GB dual-channel DDR4 ECC UDIMM kit running at 3200 MHz with CL22 latency and 1.2 V operation

  • Capacity16GB (2 x 8GB)
  • Type288-Pin DDR4 ECC UDIMM
  • SpeedDDR4 3200 (PC4 25600)
  • CAS LatencyCL22
  • Voltage1.20V
  • ECCYes

Capacity 16GB (2 x 8GB)

  • ECC protection guards data integrity in servers
  • 3200 MHz DDR4 speed handles heavy workloads
  • 20 V operation reduces power draw
  • 288-pin UDIMM fits standard server boards
  • 16 GB dual-channel kit boosts multitasking capacity

Kit composition and target use

This NEMIX RAM kit delivers 16GB of DDR4 ECC UDIMM memory across two 8GB modules. It is built for servers, workstations and NAS devices that require error-correcting unbuffered memory.

ECC impact on data integrity

The ECC function detects and corrects single-bit errors during operation, reducing the risk of silent data corruption in mission-critical workloads. Unbuffered design keeps latency low for compatible platforms.

Capacity headroom and limits

The 16GB total capacity handles typical virtualisation, file-serving and database tasks with room for moderate multitasking. Workloads that demand larger in-memory datasets or many concurrent virtual machines will exceed this kit.

Points forts

  • ECC protection guards data integrity in servers
  • 3200 MHz DDR4 speed handles heavy workloads
  • 20 V operation reduces power draw
  • 288-pin UDIMM fits standard server boards
  • 16 GB dual-channel kit boosts multitasking capacity

Caractéristiques

BrandNEMIX RAM
SeriesNEMIX RAM Original Series Memory
ModelDDR4 ECC Unbuffered UDIMM Memory
Part NumberME25600-818K2
Capacity16GB (2 x 8GB)
Type288-Pin DDR4 ECC UDIMM
SpeedDDR4 3200 (PC4 25600)
CAS LatencyCL22
Voltage1.20V
ECCYes
Buffered/RegisteredUnbuffered
Rank1Rx8
ChipsetMajor OEM Samsung, Micron, Hynix
Heat SpreaderNo
FeaturesDDR4 ECC Unbuffered UDIMM Motherboard Compatible

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2 de plus dans cette gamme

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Questions sur cet article

Will the 1Rx8 DDR4 ECC UDIMM modules need replacement if I upgrade to a platform that requires registered memory?

These are unbuffered UDIMMs, so they cannot be used in systems that require registered or load-reduced DIMMs; a platform change to registered memory would require new modules.

What limit appears first when the kit runs at 3200 MT/s CL22 continuously?

Sustained operation at DDR4 3200 with CL22 latency is constrained by the JEDEC-standard timing and voltage envelope; the memory controller's thermal and signal-integrity limits typically appear before the modules themselves.

How much heat and power does the 1.20 V kit produce during all-day workloads?

At 1.20 V the modules draw low power and have no heat spreader, so they rely on case airflow; typical DDR4 UDIMM power stays well within the 1.2 V JEDEC envelope, producing minimal additional heat.

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