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NEMIX RAM

NEMIX RAM 32GB (4x8GB) DDR4 3200 CL22 1Rx8 1.2V UDIMM memory upgrade

SKU CH-DW2X-7EVD6

32 GB DDR4 kit in four 8 GB UDIMMs at 3200 MHz CL22 for Supermicro X12STE-F and X12STD-F boards

  • Capacity32GB (4 x 8GB)
  • Type288-Pin DDR4 UDIMM
  • SpeedDDR4 3200 (PC4 25600)
  • CAS LatencyCL22
  • Voltage1.20V
  • ECCNo
  • 32 GB total capacity from four matched 8 GB modules for multi-tasking headroom
  • DDR4 3200 speed with CL22 latency runs at the board's rated frequency
  • 2 V operation keeps power draw low and matches the memory controller spec
  • 288-pin UDIMM form factor fits the Supermicro X12STE-F and X12STD-F slots exactly
  • Built with major OEM chips from Samsung, Micron or Hynix and tested for stability

Exact-match DDR4 upgrade

This 32 GB kit contains four 8 GB DDR4 3200 UDIMMs built to the 1Rx8, 1.2 V, CL22 specification your Supermicro X12STE-F or X12STD-F motherboard expects. Major OEM chips from Samsung, Micron or Hynix are tested at rated speed and voltage for reliable recognition at full capacity. The unbuffered, non-ECC design matches the board's memory population rules without extra configuration. Builders needing ECC, registered modules or a different generation cannot use this kit.

288-pin UDIMM fitment

Each module uses the standard 288-pin DDR4 UDIMM form factor that slots directly into the desktop board's four DIMM sockets. No heat spreader is fitted, so clearance around tall CPU coolers remains unrestricted. The kit frees all four slots for a single 32 GB installation, leaving no empty sockets for later expansion unless modules are removed. Systems limited to fewer than four slots or requiring SODIMM or ECC memory will not accept these modules.

Sustained-load stability

Modules are validated at DDR4 3200 (PC4-25600) with CL22 latency and 1.20 V across extended test runs, not just brief benchmarks. The 1Rx8 organisation and major-brand ICs maintain timing consistency during long compile, render or virtualisation workloads. Unbuffered operation keeps latency low for the memory controller under continuous demand. Workloads that exceed 32 GB total capacity or require error-correcting code will not be served by this configuration.

Points forts

  • 32 GB total capacity from four matched 8 GB modules for multi-tasking headroom
  • DDR4 3200 speed with CL22 latency runs at the board's rated frequency
  • 2 V operation keeps power draw low and matches the memory controller spec
  • 288-pin UDIMM form factor fits the Supermicro X12STE-F and X12STD-F slots exactly
  • Built with major OEM chips from Samsung, Micron or Hynix and tested for stability

Caractéristiques

BrandNEMIX RAM
SeriesNEMIX RAM Original Series Memory
ModelDDR4 Non-ECC Unbuffered UDIMM Memory
Part NumberMD25600-818K4
Capacity32GB (4 x 8GB)
Type288-Pin DDR4 UDIMM
SpeedDDR4 3200 (PC4 25600)
CAS LatencyCL22
Voltage1.20V
ECCNo
Buffered/RegisteredUnbuffered
Rank1Rx8
ChipsetMajor OEM Samsung, Micron, Hynix
Heat SpreaderNo
Compatible SystemSupermicro
FeaturesDDR4 Non-ECC Unbuffered UDIMM Motherboard Compatible
Package Content32GB 4X8GB DDR4 3200MHz PC4-25600 1Rx8 1.2V 288-PIN Non-ECC UDIMM KIT

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Questions sur cet article

How does the CL22 latency affect sustained throughput?

CL22 is the rated CAS latency at DDR4 3200; the kit runs at 1.20 V with 1Rx8 organization so the controller sees the expected timing at full speed.

What thermal or power behaviour should I expect during all-day operation?

The modules have no heat spreader and operate at the standard 1.20 V DDR4 voltage, so power draw and heat stay within normal JEDEC limits for unbuffered UDIMMs.

Which motherboard slot layout and population rules must my board already support?

The kit is verified for Supermicro X12STE-F and X12STD-F boards; you need four free 288-pin UDIMM slots and must follow the manual's DIMM population order.

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