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Supermicro

Supermicro X10DAI LGA2011 C612 DDR4 server motherboard

SKU CH-TZES-B5YG3

Dual-socket LGA 2011-3 board with Intel C612 chipset, 16 DDR4 slots for up to 2 TB ECC memory, 10 SATA3 ports with RAID 0, 1, 5, 10, three PCIe 3.0 x16 and two x8 slots, dual Gigabit LAN.

  • CPU Socket TypeLGA 2011-3
  • CPU TypeIntel® Xeon® processor E5-2600 v4/v3 family
  • Number of Processor Support2
  • Supported CPU TechnologiesHyper-Threading Technology
  • CPU FeaturesCPU support Up to 160W TDP / Up to 22 cores / Up to 55MB cac
  • Other ChipsetIntel® C612
  • Dual Xeon E5-2600 v3/v4 support up to 22 cores per CPU
  • 16 DDR4 slots deliver up to 2 TB ECC LRDIMM capacity
  • 10 SATA3 ports with RAID 0, 1, 5, 10 via C612
  • 3 PCIe 3.0 x16 plus 2 x8 and 1 x4 expansion slots
  • Dual Intel i210 Gigabit LAN plus 7.1 HD audio with optical S/PDIF

Dual Xeon server board with sixteen DDR4 slots

The Supermicro X10DAI is a dual-socket LGA 2011-3 motherboard built around the Intel C612 chipset. It accepts two Xeon E5-2600 v3 or v4 processors up to 160 W TDP and 22 cores each. Sixteen 288-pin DIMM slots support quad-channel DDR4-2400 memory with ECC and registered modules.

Suits builders who need two CPUs

This board targets workstation and server builds that require dual-processor throughput and up to 2 TB of LRDIMM or 1 TB of RDIMM capacity. Ten SATA3 ports with RAID 0, 1, 5 and 10 cover high-density storage arrays. Buyers who need only a single processor or fewer than sixteen memory slots should look at something else.

Sixteen DDR4 slots set the memory ceiling

The defining specification is the sixteen-slot quad-channel DDR4 layout that enables 2 TB of 3DS LRDIMM or 1 TB of RDIMM. Expansion includes three PCIe 3.0 x16, two PCIe 3.0 x8 and one PCIe 2.0 x4 slot, plus dual Gigabit LAN, 7.1 HD audio and six USB 3.0 ports.

Points forts

  • Dual Xeon E5-2600 v3/v4 support up to 22 cores per CPU
  • 16 DDR4 slots deliver up to 2 TB ECC LRDIMM capacity
  • 10 SATA3 ports with RAID 0, 1, 5, 10 via C612
  • 3 PCIe 3.0 x16 plus 2 x8 and 1 x4 expansion slots
  • Dual Intel i210 Gigabit LAN plus 7.1 HD audio with optical S/PDIF

Caractéristiques

BrandSUPERMICRO
ModelX10DAI
Part NumberMD-X10DAI-B
CPU Socket TypeLGA 2011-3
CPU TypeIntel® Xeon® processor E5-2600
v4/v3 family
Number of Processor Support2
Supported CPU TechnologiesHyper-Threading Technology
CPU FeaturesCPU support Up to 160W TDP / Up to 22 cores / Up to 55MB cache
Other ChipsetIntel® C612
Number of DDR4 Slots16 x 288-pin
DDR4 StandardDDR4-2400/2133/1866/1600MHz
Maximum Memory Supported1TB ECC/non-ECC RDIMM
2TB ECC LRDIMM
Channel SupportedQuad Channel
ECC SupportedYes
RegisteredYes
PCI Express 3.0 x163
PCI Express x82 x PCI Express x8
PCI Express x41 x PCI Express x4
SATA10 x SATA3 (6 Gbps)
SATA RAID0,1,5,10
Additional RAID ControllerAHCI SATA SATA3 (6Gbps); RAID 0, 1, 5, 10
Number of LAN2
LAN ChipsetIntel® i210
LAN Speed10/100/1000Mbps
Second LAN ChipsetIntel® i210
Second LAN SpeedIntel® i210
RJ452 x RJ45
USB 1.1/2.05 x USB 2.0 ports (2 rear + 2 via headers + 1 Type A)
USB 3.06 x USB 3.0 ports (4 rear + 2 via headers)
Other Connectors1 TPM Header
BIOS FeaturePlug and Play (PnP), PCI 2.3, ACPI 1.0 / 2.0 / 3.0 / 4.0, SMBIOS 2.7.1, UEFI 2.3.1
Form FactorEnhanced Extended ATX
Dimensions (W x L)12" x 13" (30.5cm x 33.0cm)

Questions sur cet article

What case and power connections does the E-ATX board require to fit and mount?

The board follows the E-ATX form factor with dual LGA 2011-3 sockets, 16 DDR4 DIMM slots, 3 PCI-E 3.0 x16, 2 PCI-E 3.0 x8 and 1 PCI-E 2.0 x4 slot, plus standard 24-pin ATX and 8-pin EPS power headers.

How are the two Xeon E5-2600 v3/v4 CPUs installed, and what step is often missed?

Install each processor into its LGA 2011-3 socket, apply thermal paste, attach a heatsink rated for up to 160 W TDP, then connect both CPU power headers; the step often missed is seating the second CPU and its power cable when only one processor is used initially.

Which components will need replacement or maintenance over the life of this X10DAI?

The CMOS battery on the board and the system-fan headers for active cooling are the primary service items; memory modules and PCIe add-in cards can be swapped as needed.

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