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Small white syringe with grey cap containing 1.0g grey thermal paste

Thermal Grizzly

Thermal Grizzly Hydronaut TG-H-015-R thermal paste 1.0g

SKU CH-N4GZ-VSYYF

High-conductivity 11.8 W/mK thermal paste in a 1.0 g syringe for CPUs, GPUs and consoles

  • Volume / Net Weight1.0g
  • Thermal Conductivity11.8 W/Mk
  • Specifications3.9 gram
  • FeaturesHydronaut can be used for overclocking due to it's excellent

Weight 3.9 g

  • 8 W/mK conductivity moves heat fast from CPU and GPU dies
  • 0076 K/W resistance keeps temperatures low under heavy loads
  • Zero electrical conductivity prevents short circuits on exposed components
  • Silicone-free formula stays pliable and never hardens over time
  • Rated from -200 °C to +350 °C for extreme cooling setups

Syringe format for precise application

The 1.0g syringe lets you place compound exactly where it is needed on CPU, GPU or console chips. No spreading tools are required and the paste stays where you put it during mounting.

Silicone-free compound with wide temperature range

Hydronaut remains stable from -200 °C to +350 °C and does not harden over time. The non-conductive formula eliminates short-circuit risk if excess material contacts surrounding components.

One-gram volume covers multiple installations

A single syringe provides enough paste for several CPU or GPU seats and is compatible with PlayStation and Xbox consoles as well as laptops. The 11.8 W/Mk conductivity supports high-heat loads in both air and liquid-cooled systems.

Points forts

  • 8 W/mK conductivity moves heat fast from CPU and GPU dies
  • 0076 K/W resistance keeps temperatures low under heavy loads
  • Zero electrical conductivity prevents short circuits on exposed components
  • Silicone-free formula stays pliable and never hardens over time
  • Rated from -200 °C to +350 °C for extreme cooling setups

Caractéristiques

BrandThermal Grizzly
SeriesHydronaut
ModelTG-H-015-R
Part NumberTG-H-015-R
Volume / Net Weight1.0g
Thermal Conductivity11.8 W/Mk
Specifications3.9 gram
FeaturesHydronaut can be used for overclocking due to it's excellent thermal conductivity.

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Questions sur cet article

What thermal conductivity does the Hydronaut paste rated at 11.8 W/mK deliver in practice?

The paste is specified at 11.8 W/mK thermal conductivity and 0.0076 K/W thermal resistance, enabling efficient heat transfer for air and water cooling systems.

What volume and weight does the 1.0 g syringe provide for application?

This syringe contains 1.0 g of compound, equivalent to 1.5 ml volume, enough for several CPU or GPU applications with the included nozzle.

How do I apply Hydronaut correctly and what common step should I avoid?

Clean both surfaces thoroughly, apply a small pea-sized drop or thin line on the centre of the die, then mount the cooler evenly without spreading the paste manually.

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