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AGI AI838 1TB M.2 2280 SSD with silver heatsink and green circuit board

AGI

AGI AI838 1TB internal SSD with HeatSink

SKU CH-AHC7-P5RJ5

A 1 TB M.2 2280 NVMe drive with a heatsink delivers up to 7400 MB/s read and 5500 MB/s write for demanding workloads

  • Device TypeInternal Solid State Drive (SSD)
  • Used ForConsumer
  • Form FactorM.2 2280
  • Capacity1TB
  • Memory Components3D TLC
  • InterfacePCI-Express 4.0 x4

Options AI838-1TB

  • Sequential read up to 7400 MBps for rapid game and app loading
  • Sequential write up to 5500 MBps for fast file saves and installs
  • DRAM cache and 3D TLC NAND deliver sustained performance under heavy workloads
  • Integrated heatsink maintains thermal control during extended sessions
  • 750 TBW and 2,000,000 hours MTBF indicate long-term reliability

AGI AI838 1TB PCIe 4.0 NVMe SSD with Heatsink

The AGI AI838 is a 1TB internal solid-state drive built on the M.2 2280 form factor. It uses 3D TLC NAND with an external DRAM buffer and a PCI-Express 4.0 x4 interface to deliver sequential reads up to 7400 MBps and writes up to 5500 MBps. The integrated heatsink helps maintain performance during sustained workloads on desktops or laptops. Rated for 750 TBW and 2,000,000 hours MTBF, it targets gamers and creators needing fast storage.

Installing the M.2 2280 drive

Insert the drive into a compatible M.2 slot at a slight angle and secure it with the motherboard screw. The heatsink adds 3.5 mm of height, so verify clearance under motherboard shields or laptop chassis before fitting. Common issues include forgetting to remove protective film from the thermal pads, over-tightening the retention screw, or using a slot limited to PCIe 3.0 speeds.

Check motherboard slot.

Confirm the motherboard or laptop provides an M.2 2280 slot keyed for PCI-Express 4.0 x4 NVMe operation. Measure vertical space above the slot to accommodate the 80 mm long, 22 mm wide drive with its 3.5 mm heatsink. For PlayStation 5 installation, ensure the console bay accepts the 80 mm length and that the total thickness fits Sony's specified limit. Update firmware to support NVMe 1.4 features if required.

Punti di forza

  • Sequential read up to 7400 MBps for rapid game and app loading
  • Sequential write up to 5500 MBps for fast file saves and installs
  • DRAM cache and 3D TLC NAND deliver sustained performance under heavy workloads
  • Integrated heatsink maintains thermal control during extended sessions
  • 750 TBW and 2,000,000 hours MTBF indicate long-term reliability

Caratteristiche tecniche

BrandAGI
SeriesAI838
ModelAGI1T0G44AI838
Device TypeInternal Solid State Drive (SSD)
Used ForConsumer
Form FactorM.2 2280
Capacity1TB
Memory Components3D TLC
InterfacePCI-Express 4.0 x4
Max Sequential ReadUp to 7400 MBps
Max Sequential WriteUp to 5500 MBps
Terabytes Written (TBW)750TB
MTBF2,000,000 hours
HeatSinkwith HeatSink
Features?External DRAM Buffer
?4K LDPC + RAID
?Capacity up to 4TB
?Support NVMe 1.4
?NANDXtend™ ECC Technology
?Support SMART and TRIM commands
?PS5 Compatible
Operating Temperature0°C ~ +70°C
Storage Temperature-40°C ~ +85°C
Operating HumidityHumidity: 5% to~98%RH (Non-condensing)
Max Shock Resistance1500G
Max Vibration Resistance15G
Height80mm
Width22mm
Depth3.5mm

Altre versioni di questo modello

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Domande su questo articolo

How do I confirm the drive is hitting its 7400 MBps read and 5500 MBps write speeds after installation?

Run a benchmark tool such as CrystalDiskMark using the NVMe 1.4 protocol; the results should show sequential read near 7400 MBps and write near 5500 MBps when the drive is connected to a PCI-Express 4.0 x4 slot with the heatsink attached.

What comes in the box and what must I source separately?

The package contains the M.2 2280 SSD with the integrated heatsink pre-installed; you only need to supply a compatible M.2 slot and, if your motherboard requires it, a mounting screw.

Which capacity should I choose between the available versions?

The AI838 series spans up to 4TB; the 1TB model provides 750TB TBW and the listed 7400/5500 MBps speeds, while higher capacities share the same interface and heatsink design but offer more space and proportionally higher endurance.

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