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ASUS mATX motherboard with CPU and thermal paste visible

ASUS

ASUS EX-B860M-V5/SI Intel Motherboard & Ultra 5 245K Combo

SKU CH-3XWJ-TYPZ0

A motherboard and CPU bundle with thermal paste, featuring an LGA 1851 board, Intel Ultra 5 245K processor, DDR5 memory support and 2.5G wired networking

  • CPU Socket TypeLGA 1851

model EX-B860M-V5/SI

Mostra altre 3 configurazioni

+CPU +Ultra 5 245K

  • Ready-to-build motherboard CPU and thermal grease bundle
  • 8-pin ProCool connector plus luminous anti-moisture coating for stable power and durability
  • DDR5 support with two PCIe 4.0 x16 slots and two M.2 slots for smooth gaming
  • Realtek 2.5G wired LAN certified by ASUS iCafé Lab for reboot and diskless compatibility
  • Intel Ultra 5 245K 125W processor with 24MB L3 and 26MB L2 cache plus Shin-Etsu X-23-7868-2D grease at 6.2 W/m·k conductivity

Internet Café Motherboard Combo

The ASUS EX-B860M-V5/SI motherboard ships paired with an Intel Ultra 5 245K processor and Shin-Etsu X-23-7868-2D thermal grease. The bundle targets internet café operators who need hardware validated for continuous gaming sessions and diskless boot environments.

Pre-Applied Thermal Grease && Certified

Shin-Etsu paste with 6.2 W/m.k conductivity and 0.07 °C*cm²/W resistance reduces the risk of uneven coverage during assembly. ASUS iCafé Lab certification confirms the board passes reboot and diskless-system compatibility tests for managed café deployments.

Straightforward LGA 1851 Installation

The processor drops into the LGA 1851 socket without a separate cooler in the box, so builders must supply their own mounting hardware. Applying the included gray paste is rated easy, though the 100 Pa.s viscosity demands even pressure to avoid air pockets.

Punti di forza

  • Ready-to-build motherboard CPU and thermal grease bundle
  • 8-pin ProCool connector plus luminous anti-moisture coating for stable power and durability
  • DDR5 support with two PCIe 4.0 x16 slots and two M.2 slots for smooth gaming
  • Realtek 2.5G wired LAN certified by ASUS iCafé Lab for reboot and diskless compatibility
  • Intel Ultra 5 245K 125W processor with 24MB L3 and 26MB L2 cache plus Shin-Etsu X-23-7868-2D grease at 6.2 W/m·k conductivity

Caratteristiche tecniche

BrandASUS
ModelEX-B860M-V5/SI+Ultra 5 245K
CPU Socket TypeLGA 1851

Altre versioni di questo modello

altri 5 nella stessa gamma

Stessa famiglia, con memoria, dissipatore o frequenza diversi — confronti prima di decidere.

Domande su questo articolo

When should the Shin-Etsu X-23-7868-2D thermal grease be replaced?

The manufacturer suggests a replacement cycle of two years, with an official lifespan of three to five years. The paste has a thermal conductivity of 6.2 W/m.k and thermal resistance of 0.07 °C·cm²/W.

What power limit appears first when the Ultra 5 245K runs sustained workloads?

The processor has a 125 W base power rating. Under continuous load the CPU will hold to this limit unless the motherboard firmware applies a higher PL2 setting.

How much heat must the cooler dissipate when the Ultra 5 245K runs all day?

The CPU is rated at 125 W base power. A cooler rated for at least that TDP is required; the included Shin-Etsu paste (6.2 W/m.k conductivity, 0.07 °C·cm²/W resistance) helps transfer heat efficiently.

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