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ASUS PRIME B860M-K micro-ATX motherboard with Intel Ultra 7 265K CPU and Shin-Etsu X-23-7868-2D thermal paste tube

ASUS

ASUS PRIME B860M-K mATX Intel motherboard & Ultra 7 265K CPU combo with Shin-Etsu X-23-7868-2D thermal grease

SKU CH-516K-R6YXH

A combo pairing a B860 mATX board for LGA 1851 CPUs with a 30 MB L3 cache Ultra 7 265K and Shin-Etsu 6.2 W/m·K thermal grease

  • CPU Socket TypeLGA 1851

model PRIME B860M-K

Mostra altre 3 configurazioni

+CPU +Ultra 7 265K

  • Ready-to-build combo: motherboard, CPU and Shin-Etsu thermal grease included
  • 125 W Arrow Lake processor with 30 MB L3 and 36 MB L2 cache
  • Dual M.2 slots delivering PCIe 5.0 x4 at 128 Gbps and PCIe 4.0 x4 at 64 Gbps
  • DDR5 memory optimised to 7600 MT/s via AEMP III for stable high-speed operation
  • 5 Gb Ethernet plus rear USB 10 Gbps Type-A and front USB 5 Gbps Type-C headers

Combo contents

This bundle pairs an ASUS PRIME B860M-K motherboard with an Intel Core Ultra 7 265K processor and Shin-Etsu X-23-7868-2D thermal grease. The board uses the LGA 1851 socket and Intel B860 chipset in a micro-ATX layout. A 6+1+1+1 phase digital power design with ProCool 8-pin connector feeds the CPU. DDR5 memory is supported with AEMP III optimisation for speeds of 7600 MT/s and above.

Suitability

Builders who want a ready-matched CPU and motherboard with quality paste included will find this combo convenient. The 125 W processor delivers 30 MB L3 cache and 36 MB L2 cache alongside integrated Intel Graphics. Users needing a bundled cooler or a larger ATX form factor should look at other options. The board provides one PCIe 5.0 x4 M.2 slot and one PCIe 4.0 x4 M.2 slot for fast storage.

Included extras

Shin-Etsu X-23-7868-2D grease ships in the box with a thermal conductivity of 6.2 W/m·K and resistance of 0.07 °C·cm²/W. Its grey paste has a viscosity of 100 Pa·s and is rated as easy to apply. The manufacturer suggests a replacement cycle of two years against an official lifespan of three to five years. The motherboard adds 2.5 Gb Ethernet, front USB 5 Gbps Type-C header, rear USB 10 Gbps Type-A port, dual addressable Gen2 RGB headers with Aura Sync, Fan Xpert 2+ controls and Digi+ VRM power management.

Punti di forza

  • Ready-to-build combo: motherboard, CPU and Shin-Etsu thermal grease included
  • 125 W Arrow Lake processor with 30 MB L3 and 36 MB L2 cache
  • Dual M.2 slots delivering PCIe 5.0 x4 at 128 Gbps and PCIe 4.0 x4 at 64 Gbps
  • DDR5 memory optimised to 7600 MT/s via AEMP III for stable high-speed operation
  • 5 Gb Ethernet plus rear USB 10 Gbps Type-A and front USB 5 Gbps Type-C headers

Caratteristiche tecniche

BrandASUS
ModelPRIME B860M-K+Ultra 7 265K
CPU Socket TypeLGA 1851

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Domande su questo articolo

Will the included thermal grease cover the CPU's heat spreader adequately?

The Shin-Etsu X-23-7868-2D tube provides 6.2 W/m.k conductivity and 100 Pa.s viscosity for easy, even coverage.

Does the motherboard support DDR5 memory speeds beyond standard JEDEC?

ASUS AEMP III enables DDR5-7600+(OC) operation on compatible modules for higher bandwidth.

What PCIe generation do the two M.2 slots use?

One slot runs at PCIe 5.0 x4 (128 Gbps) and the second at PCIe 4.0 x4 (64 Gbps).

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