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ASUS TUF Gaming B860M-PLUS mATX motherboard with Intel Core Ultra 7 265K CPU and Shin-Etsu thermal paste tube

ASUS

ASUS TUF GAMING B860M-PLUS Intel Ultra 7 265K Combo Intel motherboard

SKU CH-CDS7-8JK76

A motherboard-and-processor kit with an LGA 1851 board, Intel Ultra 7 265K CPU and Shin-Etsu thermal paste included

  • CPU Socket TypeLGA 1851

model TUF GAMING B860M-PLUS

Mostra altre 3 configurazioni

+CPU +Ultra 7 265K

  • Ready-to-build combo includes motherboard, CPU and Shin-Etsu thermal paste
  • 12+1+2+1 phase 80A DrMOS VRM on 8-layer PCB for stable 125W operation
  • DDR5-7600+ AEMP III with SafeDIMM slots and DIMM Fit Pro tuning
  • Triple M.2 with PCIe 5.0 x4 128Gbps plus dual PCIe 4.0 x4 64Gbps heatsinked slots
  • 5Gb LAN, rear USB 20Gbps Type-C DP Alt mode and front 10Gbps Type-C header

Combo contents

This package combines an ASUS TUF GAMING B860M-PLUS motherboard with an Intel Core Ultra 7 265K processor and Shin-Etsu X-23-7868-2D thermal grease. The bundle targets builders who want a ready-to-install platform for 12th to 14th Gen Intel Core Ultra Series 2 CPUs. The included paste simplifies the first mount.

Board layout and I/O

The mATX board uses an 8-layer PCB with a 12+1+2+1 phase 80A DrMOS VRM fed by dual ProCool 8-pin connectors. Triple M.2 slots provide one PCIe 5.0 x4 and two PCIe 4.0 x4 interfaces, each with a dedicated heatsink. Rear I/O includes 2.5Gb Ethernet and a 20Gbps USB Type-C with DP Alt mode; a front-panel 10Gbps USB Type-C header is also present.

Interface limits

DDR5 memory is supported up to 7600 MT/s via AEMP III optimisation on reinforced SafeDIMM slots. The single PCIe 5.0 M.2 slot delivers 128Gbps bandwidth while the two PCIe 4.0 slots peak at 64Gbps each. The supplied thermal grease offers 6.2 W/m·k conductivity with 0.07 °C·cm²/W resistance and a suggested two-year replacement cycle.

Punti di forza

  • Ready-to-build combo includes motherboard, CPU and Shin-Etsu thermal paste
  • 12+1+2+1 phase 80A DrMOS VRM on 8-layer PCB for stable 125W operation
  • DDR5-7600+ AEMP III with SafeDIMM slots and DIMM Fit Pro tuning
  • Triple M.2 with PCIe 5.0 x4 128Gbps plus dual PCIe 4.0 x4 64Gbps heatsinked slots
  • 5Gb LAN, rear USB 20Gbps Type-C DP Alt mode and front 10Gbps Type-C header

Caratteristiche tecniche

BrandASUS
ModelTUF GAMING B860M-PLUS+Ultra 7 265K
CPU Socket TypeLGA 1851

Altre versioni di questo modello

altri 5 nella stessa gamma

Stessa famiglia, con memoria, dissipatore o frequenza diversi — confronti prima di decidere.

Domande su questo articolo

What PCIe generation and lane count does the top M.2 slot on the TUF GAMING B860M-PLUS use?

The primary M.2 slot runs at PCIe 5.0 x4, delivering up to 128 Gbps bandwidth with a dedicated heatsink.

What CPU socket and form factor does this motherboard require for the Intel Ultra 7 265K?

The board uses an LGA 1851 socket in an mATX layout, so the case must support mATX mounting holes and the cooler must fit the LGA 1851 pattern.

How do I apply the included Shin-Etsu X-23-7868-2D thermal grease correctly on the Ultra 7 265K?

Place a small pea-sized dot in the centre of the integrated heat spreader; the cooler pressure will spread the 6.2 W/m·K paste evenly without manual spreading.

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