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Team Group

Team Group TLZGD416G3200HC16CDC 16GB DDR4 3200 CL16 desktop RAM

SKU CH-ZM4D-FZ6VX MPN TLZGD416G3200HC16CDC

16 GB dual-channel DDR4 kit running at 3200 MT/s with CL16 timing and a low-profile aluminium heat spreader

  • Capacity16GB (2 x 8GB)
  • Type288-Pin PC RAM
  • SpeedDDR4 3200 (PC4 25600)
  • CAS LatencyCL16
  • Timing16-18-18-38
  • Voltage1.35V

Capacity 16GB (2 x 8GB)

Speed DDR4 3200 (PC4 25600)

Option 16-18-18-38

  • 16 GB dual-channel kit gives smooth multitasking
  • 3200 MHz DDR4 speed delivers responsive performance
  • CL16 16-18-18-38 timing ensures low latency
  • 35 V operation reduces power draw and heat
  • Aluminium heat spreader with thermal adhesive improves cooling

Capacity and kit layout

This 16GB kit contains two 8GB modules built for DDR4 desktop platforms. The dual-channel configuration targets mainstream builders and gamers who want a straightforward memory upgrade without extra software tuning.

Compatibility fit

The kit runs at 3200 MT/s with CL16 16-18-18-38 timings at 1.35V and supports Intel XMP 2.0 on both Intel and AMD motherboards. Systems limited to lower JEDEC speeds or boards that cannot enable XMP profiles will not reach the rated frequency.

Deciding specification

The rated speed of 3200 MT/s with CL16 latency is the single figure that determines whether this kit matches the platform’s memory controller and the builder’s performance target.

Punti di forza

  • 16 GB dual-channel kit gives smooth multitasking
  • 3200 MHz DDR4 speed delivers responsive performance
  • CL16 16-18-18-38 timing ensures low latency
  • 35 V operation reduces power draw and heat
  • Aluminium heat spreader with thermal adhesive improves cooling

Caratteristiche tecniche

BrandTeam
SeriesT-FORCE VULCAN Z
ModelTLZGD416G3200HC16CDC01
Capacity16GB (2 x 8GB)
Type288-Pin PC RAM
SpeedDDR4 3200 (PC4 25600)
CAS LatencyCL16
Timing16-18-18-38
Voltage1.35V
ECCNo
Buffered/RegisteredUnbuffered
BIOS/Performance ProfileIntel XMP 2.0
ColorGray
Heat SpreaderAluminum
FeaturesSimple design to perfectly protect the cooling module
High thermal conductive adhesive
Supports Intel & AMD motherboards
Selected high-quality IC
Supports XMP2.0
Energy saving with ultra-low working voltage
Peso di spedizione0.10 kg
Dimensioni del pacco178 × 157 × 3 mm

Altre versioni di questo modello

altri 4 nella stessa gamma

Stessa famiglia, con memoria, dissipatore o frequenza diversi — confronti prima di decidere.

Domande su questo articolo

Will this 288-pin kit fit my motherboard?

The kit uses standard 288-pin DDR4 modules and supports both Intel and AMD desktop platforms.

What BIOS profile do I enable for 3200 speed?

Enable the Intel XMP 2.0 profile in BIOS to run the rated 3200 speed with 16-18-18-38 timings at 1.35V.

Do I need extra cooling for these modules?

Each stick has a 0.8 mm aluminum heat spreader with thermally conductive adhesive, so no additional cooling is required.

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