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Square grey silicone thermal pad 100 by 100 by 2.5 mm

UPSIREN

UPSIREN OEM 16W/mK Thermal Pad 100x100x2.5mm 23g

SKU CH-HBR2-V9RG7

High-conductivity 16 W/mK silicone pad measuring 100 × 100 × 2.5 mm, non-conductive and reusable for CPU, GPU or LED cooling

  • Volume / Net Weight23g
  • Thermal Conductivity16W/mk
  • Long Term Operating Temperature-40 to 200 C
  • FeaturesNon-Corrosive, Non-Curing & Non-Toxi

Option 100*100*2.5mm

  • 16 W/mK conductivity moves heat fast from chip to heatsink
  • Soft 30-shore pad compresses to fill uneven gaps
  • Non-conductive silicone insulates components electrically
  • Stable from -40 °C to 200 °C without melting
  • 100 × 100 × 2.5 mm sheet trims to fit GPU, CPU or LED

High-conductivity thermal pad

The UPSIREN OEM thermal pad delivers 16 W/mK thermal conductivity in a 100 x 100 x 2.5 mm silicone sheet weighing 23 g. It is designed to fill gaps between processors, graphics chips, LED modules or other heat sources and their heatsinks. The material is non-conductive, non-corrosive, non-curing and non-toxic, making it safe for direct die contact in laptops, desktops and industrial electronics.

Verify gap thickness and surface flatness

Measure the distance between the component and the cooler to confirm a 2.5 mm pad suits the stack-up; thinner or thicker gaps will require a different pad height. Ensure both mating surfaces are clean, flat and free of old compound so the pad’s natural viscosity can achieve full contact without air pockets. The pad operates continuously from -40 °C to 200 °C, so verify your device’s peak temperatures stay within this range.

Soft 30-degree shore hardness for conformal contact

At 30 degrees shore hardness the pad compresses easily to match uneven chip topographies while retaining enough body to stay in place during assembly. Its insulating silicone construction eliminates short-circuit risk even if the pad shifts, and the non-curing formula allows removal and repositioning during maintenance. The 100 mm square format can be trimmed with scissors for smaller dies or multiple applications from a single sheet.

Punti di forza

  • 16 W/mK conductivity moves heat fast from chip to heatsink
  • Soft 30-shore pad compresses to fill uneven gaps
  • Non-conductive silicone insulates components electrically
  • Stable from -40 °C to 200 °C without melting
  • 100 × 100 × 2.5 mm sheet trims to fit GPU, CPU or LED

Caratteristiche tecniche

BrandUPSIREN
SeriesOEM
Model16W
Volume / Net Weight23g
Thermal Conductivity16W/mk
Long Term Operating Temperature-40 to 200 C
FeaturesNon-Corrosive, Non-Curing & Non-Toxi

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Domande su questo articolo

What comes in the package and do I need anything else to install it?

The package contains one 100 x 100 x 2.5 mm silicone thermal pad weighing 23 g. No extra compound, adhesive or tools are required; the pad is naturally tacky and reusable.

How do I decide which thickness or conductivity version to pick?

This model is the 16 W/mK variant in a single 2.5 mm thickness. Choose it when your gap measures about 2.5 mm and you need 16 W/mK conductivity; other thicknesses or conductivities are separate SKUs.

What does the 16 W/mK rating actually deliver once the pad is fitted?

At 16 W/mK the pad fills the gap between chip and heatsink, stays stable from -40 °C to 200 °C, and its 30-degree shore hardness lets it compress for full contact without curing or conducting electricity.

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