UPSIREN OEM 16W/mK Thermal Pad 100x100x2.5mm 23g

High-conductivity thermal pad

The UPSIREN OEM thermal pad delivers 16 W/mK thermal conductivity in a 100 x 100 x 2.5 mm silicone sheet weighing 23 g. It is designed to fill gaps between processors, graphics chips, LED modules or other heat sources and their heatsinks. The material is non-conductive, non-corrosive, non-curing and non-toxic, making it safe for direct die contact in laptops, desktops and industrial electronics.

Verify gap thickness and surface flatness

Measure the distance between the component and the cooler to confirm a 2.5 mm pad suits the stack-up; thinner or thicker gaps will require a different pad height. Ensure both mating surfaces are clean, flat and free of old compound so the pad’s natural viscosity can achieve full contact without air pockets. The pad operates continuously from -40 °C to 200 °C, so verify your device’s peak temperatures stay within this range.

Soft 30-degree shore hardness for conformal contact

At 30 degrees shore hardness the pad compresses easily to match uneven chip topographies while retaining enough body to stay in place during assembly. Its insulating silicone construction eliminates short-circuit risk even if the pad shifts, and the non-curing formula allows removal and repositioning during maintenance. The 100 mm square format can be trimmed with scissors for smaller dies or multiple applications from a single sheet.