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ARCTIC COOLING
Single-tower air cooler with four staggered heat pipes and a 120 mm fan fits Intel 1700, 1200 and 115x sockets without blocking tall RAM modules
The ARCTIC COOLING Freezer i35 is a single-tower CPU air cooler designed for Intel Socket 1700, 1200 and 115x platforms. It uses four staggered heat pipes with direct-touch technology to move heat from the processor into the aluminium fin stack. A 120 mm pressure-optimised fan then dissipates that heat. The compact layout leaves full clearance for memory modules with tall heatsinks. A 0.8 g sachet of MX-5 thermal paste is included for installation.
The Intel-specific mounting kit reduces hardware to the essentials, so the cooler fits Socket 1700, 1200 and 115x without extra brackets. Because the tower is narrow, it does not overhang the first DIMM slot, allowing any RAM height. The cooler relies on a single 120 mm fan; there is no provision for a second fan or for liquid-cooling integration. Builders needing dual-fan push-pull or radiator mounting must look elsewhere.
Four heat pipes and a 120 mm fan give enough capacity for typical high-end desktop CPUs at stock settings and moderate overclocks. Sustained all-core workloads at very high power will eventually saturate the single-tower fin area, causing fan speed and temperature to rise. The included MX-5 paste ensures reliable contact from the first mount. Users chasing maximum overclock headroom or silent operation under extreme loads will need a larger dual-tower or liquid cooler.
| Series | Freezer i35 |
|---|---|
| Type | Fan & Heatsinks |
| CPU Socket Compatibility | Intel Socket 1700, 1200, 115x |
| 配送重量 | 1.00 kg |
| 梱包サイズ | 170 × 147 × 114 mm |
The ACFRE00094A model covers Intel Socket 1700, 1200 and 115x in a single package, so you do not need to pick a separate variant for your platform.
The pressure-optimised 120 mm fan pushes air through the tower heatsink, letting the four staggered heat pipes move heat away from high-end Intel CPUs under sustained load.
Four heat pipes make direct contact with the CPU lid, giving a low-resistance path that lets the cooler handle high-end Intel chips without hitting a thermal bottleneck.
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