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Computer Memory Solutions

Computer Memory Solutions CM5126412800SOSRL 4GB DDR3L 1600 CL11 1.35V 204-Pin SO-DIMM memory upgrade

SKU CH-77VT-N434W

4GB DDR3L 1600 SO-DIMM module for ASUS X Series X555DG, X555UA, X555UJ and X556UA notebooks

  • Capacity4GB
  • Type204-Pin DDR3 SO-DIMM
  • SpeedDDR3L 1600 (PC3L 12800)
  • CAS LatencyCL11
  • Timing11-11-11
  • Voltage1.35V
  • 4GB capacity adds responsive multitasking headroom
  • DDR3L 1600 MHz speed keeps data flowing smoothly
  • 35V low-voltage operation reduces power draw
  • CL11 11-11-11 timing delivers snappy access latency
  • Tested compatible with ASUS X555 and X556 notebooks

4GB DDR3L SO-DIMM for ASUS X Series

This 4 GB DDR3L module is built for ASUS X Series notebooks including the X555DG, X555UA, X555UJ and X556UA. It runs at 1600 MHz with CL11 timing at 1.35 V. The unbuffered, non-ECC design fits the 204-pin SO-DIMM slot used by these laptops.

Single-stick kit with lifetime exchange

The package contains one memory stick, so there is no dual-channel kit to manage. Computer Memory Solutions backs the module with a lifetime exchange or repair warranty against manufacturing defects when purchased directly from them. A 30-day money-back window is also offered.

12 GB ceiling on a single slot

The supported platforms list a maximum of 12 GB and provide only one memory socket. This 4 GB stick leaves headroom for an 8 GB module if the board accepts it, but a second stick cannot be added. Buyers needing more than 12 GB total or a second channel should look elsewhere.

特長

  • 4GB capacity adds responsive multitasking headroom
  • DDR3L 1600 MHz speed keeps data flowing smoothly
  • 35V low-voltage operation reduces power draw
  • CL11 11-11-11 timing delivers snappy access latency
  • Tested compatible with ASUS X555 and X556 notebooks

仕様

BrandComputer Memory Solutions
ModelCM5126412800SOSRL
Capacity4GB
Type204-Pin DDR3 SO-DIMM
SpeedDDR3L 1600 (PC3L 12800)
CAS LatencyCL11
Timing11-11-11
Voltage1.35V
ECCNo
Buffered/RegisteredUnbuffered
Rank1Rx8
ChipsetMajor Brand Chipset
Heat SpreaderNo
Compatible SystemASUS X Series Notebook X555DG, X555UA, X555UJ X556UA
Package Content1Memory Ram Stick

この商品に関する質問

Will the 204-pin DDR3L SO-DIMM need replacement if I later upgrade to the 12GB maximum supported by the X555UA?

The notebook supports up to 12GB total; adding this 4GB stick leaves room for further modules, so replacement is not required unless you exceed the socket limit.

What timing bottleneck appears first during sustained loads on this CL11 1600 MHz module?

The fixed 11-11-11 latency and 1600 MHz data rate set the bandwidth ceiling; under continuous use the CAS latency becomes the limiting factor before thermal throttling.

How much heat and power does the 1.35V unbuffered stick produce when running all day in an X556UA?

At 1.35V the DDR3L module draws low power and runs cooler than standard DDR3, and with no heat spreader it relies on the notebook's existing airflow for passive cooling.

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