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ATX motherboard with black heatsinks and silver accents

GIGABYTE

GIGABYTE X870E AORUS ELITE X3D AMD motherboard

SKU CH-TSXJ-8S9T5 MPN X870E AORUS ELITE X3D

AM5 ATX board for Ryzen 7000, 8000 and 9000 CPUs with DDR5 up to 9000 MT/s, 16+2+2 phase VRM, four M.2 slots, PCIe 5.0, USB4 Type‑C, Wi‑Fi 7 and Bluetooth 5.4

  • CPU Socket TypeAM5
  • CPU TypeRyzen 7000 Series / Ryzen 8000 Series / Ryzen 9000 Series
  • ChipsetAMD X870E
  • Number of Memory Slots4x288pin (DDR5)
  • Memory StandardUp to DDR5 9000(O.C)
  • Maximum Memory Supported256GB

Model X870E AORUS ELITE X3D

  • AI-optimised X3D Turbo Mode 2.0 boosts gaming performance up to 25%
  • DDR5 overclocking reaches 9000 MT/s for faster memory speeds
  • 16+2+2 digital-twin power phases deliver stable CPU power
  • Four M.2 slots with EZ-Flex heatsinks keep storage cool
  • WIFI 7 and BLUETOOTH 5.4 provide high-speed wireless connectivity

Socket AM5 X3D Platform

The GIGABYTE X870E AORUS ELITE X3D is an ATX motherboard for AMD Ryzen 7000, 8000 and 9000 series processors. It targets builders who want an X3D optimised platform with high-speed connectivity and robust power delivery for gaming and multitasking workloads.

AI X3D Turbo and DDR5 9000

X3D Turbo Mode 2.0 uses an onboard AI model to adjust Ryzen X3D processor parameters in real time, delivering up to 25 per cent higher gaming performance with one click. Four DDR5 slots support AMD EXPO and Intel XMP 3.0 profiles up to 9000 MT/s, while the 16+2+2 phase digital VRM and M.2 EZ-Flex baseplate keep thermals in check during sustained loads.

Four M.2 Slots and WIFI 7

Four M.2 sockets provide flexible NVMe storage expansion, and the rear I/O includes USB4 Type-C, 5 Gbps LAN, WIFI 7 and BLUETOOTH 5.4 for modern peripherals. Users needing ECC memory, workstation certifications or a smaller form factor should consider alternative chipsets or board sizes.

特長

  • AI-optimised X3D Turbo Mode 2.0 boosts gaming performance up to 25%
  • DDR5 overclocking reaches 9000 MT/s for faster memory speeds
  • 16+2+2 digital-twin power phases deliver stable CPU power
  • Four M.2 slots with EZ-Flex heatsinks keep storage cool
  • WIFI 7 and BLUETOOTH 5.4 provide high-speed wireless connectivity

仕様

BrandGIGABYTE
ModelX870E AORUS ELITE X3D
CPU Socket TypeAM5
CPU TypeRyzen 7000 Series / Ryzen 8000 Series / Ryzen 9000 Series
ChipsetAMD X870E
Number of Memory Slots4x288pin (DDR5)
Memory StandardUp to DDR5 9000(O.C)
Maximum Memory Supported256GB
Channel SupportedDual Channel
Memory Performance ProfileAMD EXPO / Intel XMP 3.0
ECC SupportedNon-ECC
Buffer SupportedUn-buffered
PCI Express 5.0 x161 x PCI Express x16 slot (PCIEX16), integrated in the CPU:
AMD Ryzen 9000/7000 Series Processors support PCIe 5.0 x16 mode
AMD Ryzen 8000 Series-Phoenix 1 Processors support PCIe 4.0 x8 mode
AMD Ryzen 8000 Series-Phoenix 2 Processors support PCIe 4.0 x4 mode
* The PCIEX16 slot can only support a graphics card or an NVMe SSD. If only one graphics card is to be installed, be sure to install it in the PCIEX16 slot.
Chipset:
- 1 x PCI Express x16 slot, supporting PCIe 4.0 and running at x4 (PCIEX4)
- 1 x PCI Express x16 slot, supporting PCIe 3.0 and running at x2 (PCIEX2)
M.21 x M.2 connector (M2A_CPU), integrated in the CPU, supporting Socket 3, M key, type 25110/22110/2580/2280 SSDs:
AMD Ryzen 9000/7000 Series Processors support PCIe 5.0 x4/x2 SSDs
AMD Ryzen 8000 Series-Phoenix 1 Processors support PCIe 4.0 x4/x2 SSDs
AMD Ryzen 8000 Series-Phoenix 2 Processors support PCIe 4.0 x4/x2 SSDs
1 x M.2 connector (M2B_CPU), integrated in the CPU, supporting Socket 3, M key, type 22110/2280 SSDs:
AMD Ryzen 9000/7000 Series Processors support PCIe 5.0 x4/x2 SSDs
* The M2B_CPU connector shares bandwidth with the ASMedia USB4 controller. When a device is installed
SATA RAIDRAID 0, RAID 1, RAID 5, and RAID 10 support for NVMe SSD storage devices
* RAID 5 is only available on AMD Ryzen 9000 Series Processors.
RAID 0 and RAID 1 support for SATA storage devices
Audio ChipsetRealtek ALC1220
Audio Channels7.1 Channels
Max LAN Speed5Gbps
Wireless LANWi-Fi 802.11 be
BluetoothBLUETOOTH 5.4
Back I/O Ports1 x HDMI port (Note)
1 x reset button
1 x power button
1 x Clear CMOS button
1 x Q-Flash Plus button
5 x USB 3.2 Gen 2 Type-A ports (red)
1 x USB Type-C port, with USB 3.2 Gen 2 support
2 x USB4 USB Type-C ports (DisplayPort (Note))
1 x RJ-45 port
3 x USB 3.2 Gen 1 ports
2 x antenna connectors (2T2R)
2 x audio jacks
1 x optical S/PDIF Out connector
Onboard USB1 x USB Type-C header, with USB 3.2 Gen 2x2 support
2 x USB 3.2 Gen 1 headers
2 x USB 2.0/1.1 headers
Other Connectors1 x PCIe power connector
1 x CPU fan header
1 x CPU fan/water cooling pump header
4 x system fan headers
2 x system fan/water cooling pump headers
3 x addressable RGB Gen2 LED strip headers
1 x RGB LED strip header
4 x M.2 Socket 3 connectors
4 x SATA 6Gb/s connectors
1 x front panel header
1 x front panel audio header
1 x Trusted Platform Module header (For the GC-TPM2.0 SPI V2 module only)
1 x HDMI port (Note)
1 x reset jumper
1 x Clear CMOS jumper
2 x temperature sensor headers
1 x noise detection header
Form FactorATX
Dimensions (W x L)12.0" x 9.6"
Power Pin1 x 24-pin ATX main power connector
2 x 8-pin ATX 12V power connectors
BIOS Feature1 x 512 Mbit flash
Use of licensed AMI UEFI BIOS
PnP 1.0a, DMI 2.7, WfM 2.0, SM BIOS 2.7, ACPI 5.0
配送重量2.99 kg
梱包サイズ345 × 295 × 84 mm

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この商品に関する質問

Will the 16+2+2 phase VRM need extra cooling or replacement after long use?

The digital twin 16+2+2 phase VRM is designed for sustained operation with the included heatsink; no user-serviceable parts are expected to wear out under normal conditions.

Which limit appears first when the board runs at DDR5 9000 MT/s continuously?

Memory stability at the 9000 MT/s overclock ceiling typically becomes the limiting factor before the VRM or chipset thermals under sustained load.

How loud and hot does the M.2 EZ-Flex heatsink get during all-day workloads?

The patented EZ-Flex baseplate spreads heat across the M.2 slot area, keeping SSD temperatures in check with passive cooling and no added fan noise.

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