EN-Labs 11-001-366 PCIe x4 USB 3.2 10Gbps 5-port card
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Intel
120-core server CPU with 240 threads, 2.1 GHz base clock, 3.9 GHz max turbo, 504 MB L3 cache, DDR5-6400 support, and 500 W TDP
The Intel Xeon 6 6979P is a 120-core server processor designed for dense compute clusters and memory-heavy workloads. It delivers 240 threads at a 2.1 GHz base frequency with a 3.9 GHz maximum turbo. The 3 nm Granite Rapids architecture supports twelve DDR5-6400 channels and up to 3 TB of memory.
A 500 W TDP defines the thermal envelope for sustained all-core operation. Six UPI links at 24 GT/s provide coherent interconnect bandwidth between sockets in two-socket platforms. The LGA-7529 socket and 3 nm process enable the core density without exceeding the rated power limit.
Twelve memory channels and PCIe 5.0 lanes are exposed directly from the package, removing the need for external controllers. Virtualization technology and 64-bit support are active across all 240 threads. The OEM package includes no cooler or software, so integrators supply their own thermal solution and management stack.
| Brand | Intel |
|---|---|
| Series | Xeon 6 |
| Name | Xeon 6979P |
| Model | PK8072006023000 |
| CPU Socket Type | FCLGA 7529 |
| Core Name | Granite Rapids |
| # of Cores | 120-Core |
| # of Threads | 240 |
| Operating Frequency | 2.1 GHz |
| Max Turbo Frequency | 3.9 GHz |
| L3 Cache | 504MB |
| 64-Bit Support | Yes |
| Hyper-Threading Support | Yes |
| Manufacturing Tech | 3 nm |
| Integrated Memory Controller Speed | DDR5 6400 |
| Maximum Memory Capacity | 3TB |
| Memory Channel | 12 Channel |
| Virtualization Technology Support | Yes |
| Scalability | 2S |
| PCI Express Revision | 5.0 |
| Max # of PCI Express Lanes | 96 |
| Thermal Design Power | 500W |
| Cooling Device | Cooling device not included - Processor Only |
| 配送重量 | 0.12 kg |
| 梱包サイズ | 78 × 64 × 57 mm |
Align the notches on the 120-core chip with the socket keys, lower it straight down without pressure, then close the retention lever until it clicks; the step most often missed is verifying the lever is fully latched before applying thermal paste.
Plan to clean dust from the heatsink fins and replace the thermal interface material every 12 to 24 months to maintain the 2.1 GHz base frequency under sustained load.
The 500 W thermal envelope is reached before the 12-channel DDR5 6400 memory bandwidth saturates, so the processor will throttle to stay within its power budget.
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