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Green rectangular DIMM with black memory chips and gold contacts

Micron Technology, Inc.

Micron Technology, Inc. 512MB PC133 CL3 ECC REG DIMM desktop RAM

SKU CH-X6MJ-PKMS2

512 MB PC133 CL3 ECC registered desktop memory for legacy systems

  • Capacity512MB
  • 512 MB capacity supports demanding legacy applications
  • PC133 CL3 timing delivers reliable synchronous performance
  • ECC registered design detects and corrects memory errors
  • Micron MT18LSDT6472G-133D2 module built for stable desktop operation

512 MB PC133 ECC registered DIMM

This 512 MB PC133 CL3 ECC registered DIMM is built for legacy desktop systems that require registered memory with error correction. It suits repair technicians and hobbyists maintaining hardware that uses the PC133 standard. The module provides basic capacity for older workstations or servers that depend on registered buffering. Buyers needing higher density or faster speeds should look elsewhere.

MT18LSDT6472G-133D2 part detail

The part number MT18LSDT6472G-133D2 identifies the exact 512 MB 133 CL3 ECC REG configuration. No extra accessories, software or heat spreaders are included with the module. The bare DIMM is ready for installation in compatible slots. Systems that require unbuffered or non-ECC memory cannot use this stick.

特長

  • 512 MB capacity supports demanding legacy applications
  • PC133 CL3 timing delivers reliable synchronous performance
  • ECC registered design detects and corrects memory errors
  • Micron MT18LSDT6472G-133D2 module built for stable desktop operation

仕様

Capacity512MB

この商品に関する質問

Will the registered ECC design require any special handling when I install or remove the module?

The registered buffer adds a slight mechanical height; handle the DIMM by its edges and seat it firmly until the retention clips click, just as with any standard desktop module.

What is the first limitation I will hit when running this memory continuously at its rated 133 MHz speed?

The CL3 latency and 133 MHz bus set the maximum sustainable bandwidth; sustained workloads will be bound by that throughput ceiling rather than thermal or voltage limits.

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