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Green rectangular SODIMM stick with black chips and gold edge contacts

SAMSUNG

SAMSUNG 16GB DDR4 2666MHz CL19 260-pin SODIMM laptop RAM

SKU CH-K209-6AS8F

16 GB DDR4 SODIMM runs at 2666 MHz with CL19 latency and 1.2 V operation for laptop upgrades

  • 16 GB capacity handles demanding multitasking
  • 2666 MHz DDR4 speed delivers responsive performance
  • CL19 latency supports smooth data access
  • 2 V operation reduces power draw
  • 260-pin SODIMM form factor fits compatible laptops

16 GB DDR4 SODIMM

This Samsung laptop memory module provides 16 GB of DDR4 capacity in a 260-pin SODIMM form factor. It operates at 2666 MHz with CL19 latency and a low 1.2 V voltage. The unbuffered, non-ECC design is built for standard laptop and all-in-one PC upgrades.

Upgrade compatibility

It suits owners of laptops or all-in-one PCs that accept DDR4 SODIMMs running at 2666 MHz. Buyers who need ECC error correction, registered modules, or a different pin count should look elsewhere.

260-pin DDR4 interface

The module uses the 260-pin DDR4 SODIMM interface, which determines whether it fits the memory slot. Verify that your system requires this exact pin count and DDR4 technology before purchasing.

特長

  • 16 GB capacity handles demanding multitasking
  • 2666 MHz DDR4 speed delivers responsive performance
  • CL19 latency supports smooth data access
  • 2 V operation reduces power draw
  • 260-pin SODIMM form factor fits compatible laptops

仕様

この商品の仕様はまだ公開されていません。

この商品に関する質問

Does the 260-pin SODIMM module require any periodic cleaning or replacement?

The module has no moving parts and is rated for a limited lifetime warranty, so no scheduled maintenance or replacement is needed.

What is the first limit reached when the memory runs continuously at 2666 MHz?

The 1.2 V operating voltage and CL19 latency are fixed specifications; sustained loads stay within those electrical and timing boundaries.

How much heat and power does the 16 GB stick draw during all-day operation?

DDR4 at 1.2 V reduces power consumption by up to 40 % compared with previous generations, lowering heat output for extended use.

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