Team Group MP44S TM5FF3001T0C101 1TB M.2 2230 internal SSD
- Internal Solid Stat…
- Consumer
Team Group
M.2 2230 2TB PCIe 4.0 x4 NVMe internal SSD with up to 5000 MBps read and 3500 MBps write, graphene heat label, 450TB TBW
Options 2TB
The Team Group MP44S fits the 2230 form factor used in devices such as the Steam Deck and ROG Flow Z13. It delivers 2TB of NVMe storage for games, video and large data sets. The PCIe 4.0 x4 interface provides up to 5000 MBps sequential read and 3500 MBps sequential write. Random performance reaches 480000 IOPS read and 500000 IOPS write.
A patented graphene label under 1mm thick spreads heat without adding mechanical interference. The drive is rated for 0°C to 70°C operating temperature and 90% humidity at 40°C. With no DRAM cache it relies on host memory buffer, keeping power draw low during typical workloads. Endurance is rated at 450TB written and 1500000 hours MTBF.
The 22mm by 30mm PCB slides into any M.2 2230 key-M socket and works with PCIe 3.0 hosts at reduced speed. No heatsink clearance or extra power cables are required. The compact length frees space in tight chassis designs while the 2TB capacity removes the need for external storage. Recyclable packaging ships with the drive.
| Brand | Team Group |
|---|---|
| Series | MP44S |
| Model | TM5FF3002T0C101 |
| Device Type | Internal Solid State Drive (SSD) |
| Used For | Consumer |
| Form Factor | M.2 2230 |
| Capacity | 2TB |
| Interface | PCIe 4.0 x4 with NVMe |
| Protocol | NVMe |
| Cache | No DRAM (HMB) |
| Max Sequential Read | Up to 5000 MBps |
| Max Sequential Write | Up to 3500 MBps |
| 4KB Random Read | Up to 480,000 IOPS |
| 4KB Random Write | Up to 500,000 IOPS |
| Terabytes Written (TBW) | 450TB |
| MTBF | 1,500,000 hours |
| Features | Top choice for STEAM Deck capacity upgrade Top choice for capacity upgrade on lightweight devices Heat dissipating graphene label for enhanced heat dissipation and system operating stability Small-size solution offering TB-grade massive capacity Gen4 read/write speed compatible with PCIe Gen3 interface Recyclable packaging contributing to sustainability endeavors TEAMGROUP’s exclusive patented S.M.A.R.T. monitoring software |
| Operating Temperature | 0°C ~ +70°C |
| Storage Temperature | -40°C ~ +85°C |
| Operating Humidity | RH 90% under 40 celsius degree |
| Max Shock Resistance | 1,500G / 0.5 ms |
| Max Vibration Resistance | 80~2,000 Hz / 20G |
| Height | 3.70mm |
| Width | 22.00mm |
| Depth | 30.00mm |
| Weight | 3.00g |
| 配送重量 | 0.02 kg |
| 梱包サイズ | 124 × 94 × 12 mm |
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The M.2 2230 form factor matches the Steam Deck slot exactly, and the graphene label is under 1 mm thick so it clears the chassis.
The integrated graphene label provides the thermal solution; no additional heatsink is needed for normal operation.
Yes, the PCIe 4.0 x4 interface is backward compatible with PCIe 3.0 slots and will run at Gen 3 speeds.
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